产品系列

罗斌森

DIP-ADAPTER-EVM
Manufacturer : Texas Instruments
Part Status : Active
Proto Board Type : SMD to Plated Through Hole
Package Accepted : MSOP, SC70, SOIC, SOT23, SOT563, TSSOP
Number of Positions : 8

THS5671AIDWRG4	TI	28-SOIC	New	详细
型号	品牌	封装	批号	查看
SN74LVCC4245ANSR	TI	24-SO	New	详细
TL3845DR-8	TI	8-SOIC	New	详细
SN74BCT8240ANTG4	TI	24-PDIP	New	详细
OPA404KP	TI	14-PDIP	New	详细
CD4517BE	TI	16-PDIP	New	详细
DS38EP100SD/NOPB	TI	6-WSON (2.2x2.5)	New	详细
CD4025BNSR	TI	14-SOP	New	详细
SN75C188D	TI	14-SOIC	New	详细
UCC38085P	TI	8-PDIP	New	详细
OMAPL138BZWTD4	TI	361-NFBGA (16x16)	New	详细
LP5951MGX-2.5	TI	SC-70-5	New	详细
CD74FCT244SM96G4	TI	20-SSOP	New	详细
LM3414MR/NOPB	TI	8-SO PowerPad	New	详细
TPS3707-30D	TI	8-SOIC	New	详细
SN74LVCZ240APWR	TI	20-TSSOP	New	详细
SN74ALS564BN	TI		New	详细
CD74HCT670M96E4	TI	16-SOIC	New	详细
TPS61100PW	TI	20-TSSOP	New	详细
SN74ALS29863DWRG4	TI	24-SOIC	New	详细