罗斌森
  • DAC8830MCDREP

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Discontinued at Digi-Key
    Operating Temperature : -55°C ~ 125°C
    Package / Case : 8-SOIC (0.154", 3.90mm Width)
    Supplier Device Package : 8-SOIC
    Mounting Type : Surface Mount

极速报价

型号
品牌 封装 批号 查看
PT4121A TI New 详细
SN74ALS641ADWR TI 20-SOIC New 详细
TPS77925DGK TI 8-VSSOP New 详细
EK-TM4C123GXL TI New 详细
LM3S1B21-IBZ80-C5 TI 108-BGA (10x10) New 详细
SN74AHC16373DGGR TI 48-TSSOP New 详细
LM2592HVS-3.3/NOPB TI DDPAK/TO-263-5 New 详细
SN74ABT827NT TI 24-PDIP New 详细
TLV5639CDWRG4 TI 20-SOIC New 详细
SN74BCT241N TI 20-PDIP New 详细
LP55271TLX/NOPB TI 30-TuSMD New 详细
ADC32RF82IRMPR TI New 详细
LM2578AMX TI 8-SOIC New 详细
SN74LVCE161284DGGR TI 48-TSSOP New 详细
CC2540TDK-LIGHT TI New 详细
AM26C31IDRG4 TI 16-SOIC New 详细
BQ2057CTS TI 8-TSSOP New 详细
SN75971B2DLRG4 TI 56-SSOP New 详细
TPS562209EVM-601 TI New 详细
SN74AS241ADWE4 TI 20-SOIC New 详细