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  • DAC8771RGZT

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Number of Bits : 16
    Number of D/A Converters : 1
    Settling Time : 30μs
    Output Type : Voltage or Current - Buffered
    Differential Output : No
    Data Interface : SPI
    Reference Type : External, Internal
    Voltage - Supply, Analog : 12V ~ 36V
    Voltage - Supply, Digital : 2.7V ~ 5.5V
    INL/DNL (LSB) : ±10 (Max), ±1 (Max)
    Architecture : String DAC
    Operating Temperature : -40°C ~ 125°C (TA)
    Package / Case : 48-VFQFN Exposed Pad
    Supplier Device Package : 48-VQFN (7x7)
    Mounting Type : Surface Mount

极速报价

型号
品牌 封装 批号 查看
SN74ACT7808-25PAG TI 64-TQFP (10x10) New 详细
LP2981AIM5X-3.3 TI SOT-23-5 New 详细
ISO7221CHD TI 8-SOIC New 详细
OPA3832IPWRG4 TI 14-TSSOP New 详细
SN74LVTH543NSRG4 TI 24-SO New 详细
MSP430FR6989IPN TI 80-LQFP (12x12) New 详细
TPIC6B595DWG4 TI 20-SOIC New 详细
LP2985AIBPX-2.5/NOPB TI 5-μSMD (0.93x1.11) New 详细
LM26CIM5-TPA TI SOT-23-5 New 详细
SN74F521DW TI New 详细
TLV320AIC14KEVM TI New 详细
UCC3976PW TI 8-TSSOP New 详细
OPA2832IDGKR TI 8-VSSOP New 详细
LM2588S-5.0/NOPB TI DDPAK/TO-263-7 New 详细
TPS74601PDRVT TI New 详细
LP3971SQ-B410 TI 40-WQFN (5x5) New 详细
TPS23750PWPR TI 20-HTSSOP New 详细
TPS7233QPWG4 TI 8-TSSOP New 详细
LP2952AIM-3.3/NOPB TI 16-SOIC New 详细
LM3209TLE/NOPB TI 12-DSBGA (2x2.5) New 详细