产品系列

罗斌森
  • ISOW7844DWE

  • Manufacturer : Texas Instruments
    Packaging : Tube
    Alternate Packaging
    Part Status : Active
    Technology : Capacitive Coupling
    Type : General Purpose
    Isolated Power : Yes
    Number of Channels : 4
    Inputs - Side 1/Side 2 : 0/4
    Channel Type : Unidirectional
    Voltage - Isolation : 5000Vrms
    Common Mode Transient Immunity (Min) : 100kV/μs
    Data Rate : 100Mbps
    Propagation Delay tpLH / tpHL (Max) : 17.6ns, 17.6ns
    Pulse Width Distortion (Max) : 4.7ns
    Rise / Fall Time (Typ) : 2ns, 2ns
    Voltage - Supply : 3V ~ 5.5V
    Operating Temperature : -40°C ~ 125°C
    Mounting Type : Surface Mount
    Package / Case : 16-SOIC (0.295", 7.50mm Width)
    Supplier Device Package : 16-SOIC

极速报价

型号
品牌 封装 批号 查看
SN74ACT374NSR TI New 详细
INA1620RTWR TI 24-WQFN (4x4) New 详细
THS6072CDGNRG4 TI 8-MSOP-PowerPad New 详细
SM320C6748EGWTS3 TI 361-NFBGA (16x16) New 详细
LM2722M/NOPB TI 8-SOIC New 详细
LM4050BEM3-2.0/NOPB TI SOT-23-3 New 详细
BQ25600CYFFT TI 30-DSBGA New 详细
SN74CBTLV3253DR TI 16-SOIC New 详细
LM2575S-15/NOPB TI DDPAK/TO-263-5 New 详细
DS42BR400TSQ TI 60-WQFN (9x9) New 详细
OMAP3503DCBC TI 515-POP-FCBGA (14x14) New 详细
AM3354ZCED50 TI 298-NFBGA (13x13) New 详细
COP8CCE9IMT7 TI 48-TSSOP New 详细
TPS43333QDAPRQ1 TI 38-HTSSOP New 详细
BQ24155RGYR TI 14-VQFN (3.5x3.5) New 详细
TMS32C6414EGLZA5E0 TI 532-FCBGA (23x23) New 详细
LM2679S-5.0/NOPB TI DDPAK/TO-263-7 New 详细
SN74ALVCH16240DGGR TI 48-TSSOP New 详细
SN74F174AN TI New 详细
UCC2921N TI 8-PDIP New 详细