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  • ISO7763FDBQ

  • Manufacturer : Texas Instruments
    Packaging : Tube
    Alternate Packaging
    Part Status : Active
    Technology : Capacitive Coupling
    Type : General Purpose
    Isolated Power : No
    Number of Channels : 6
    Inputs - Side 1/Side 2 : 3/3
    Channel Type : Unidirectional
    Voltage - Isolation : 3000Vrms
    Common Mode Transient Immunity (Min) : 85kV/μs
    Data Rate : 100Mbps
    Propagation Delay tpLH / tpHL (Max) : 16ns, 16ns
    Pulse Width Distortion (Max) : 4.9ns
    Rise / Fall Time (Typ) : 1.1ns, 1.4ns
    Voltage - Supply : 2.25V ~ 5.5V
    Operating Temperature : -55°C ~ 125°C
    Mounting Type : Surface Mount
    Package / Case : 16-SSOP (0.154", 3.90mm Width)
    Supplier Device Package : 16-SSOP

极速报价

型号
品牌 封装 批号 查看
LM2647LQX/NOPB TI 28-WQFN (5x5) New 详细
TPS71733DRVR TI 6-WSON (2x2) New 详细
SN74LV244ATPWR TI 20-TSSOP New 详细
PDRV5013AGQDBZT TI SOT-23-3 New 详细
LP38798EVM TI New 详细
SN74AHCT139N TI 16-PDIP New 详细
TPS22967DSGT TI 8-WSON (2x2) New 详细
TPS3851H30EDRBT TI 8-SON (3x3) New 详细
LM9074M TI 14-SOIC New 详细
TSC2008EVM TI New 详细
TPS79918DDCT TI SOT-23-5 New 详细
TAS5614PHD TI 64-HTQFP (14x14) New 详细
LP3996SD-3033EV TI New 详细
LM4050AEM3X-2.0/NOPB TI SOT-23-3 New 详细
SN74ALVCHR16269GR TI 56-TSSOP New 详细
CD74HCT08M TI 14-SOIC New 详细
TLV1117-50CDCY TI SOT-223-4 New 详细
LMH6551QMME/NOPB TI 8-VSSOP New 详细
SN74ALVCHR162245DL TI 48-SSOP New 详细
LP3875ESX-3.3/NOPB TI DDPAK/TO-263-5 New 详细