产品系列

罗斌森
  • CSD87313DMST

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : NexFET?
    Part Status : Active
    FET Type : 2 N-Channel (Dual) Common Drain
    FET Feature : Standard
    Drain to Source Voltage (Vdss) : 30V
    Vgs(th) (Max) @ Id : 1.2V @ 250μA
    Gate Charge (Qg) (Max) @ Vgs : 28nC @ 4.5V
    Input Capacitance (Ciss) (Max) @ Vds : 4290pF @ 15V
    Power - Max : 2.7W
    Operating Temperature : -55°C ~ 150°C (TJ)
    Mounting Type : Surface Mount
    Package / Case : 8-PowerWDFN
    Supplier Device Package : 8-WSON (3.3x3.3)

极速报价

型号
品牌 封装 批号 查看
LP3964ES-3.3/NOPB TI DDPAK/TO-263-5 New 详细
LM5088MH-1EVAL/NO TI New 详细
SN74AUC2G79DCTR TI New 详细
DP83847ALQA56A/NOPB TI 56-WQFN (9x9) New 详细
LP5900TLX-2.1/NOPB TI 4-DSBGA (1x1) New 详细
TMX320F28069PZPA TI 100-LQFP (14x14) New 详细
ADS900E TI 28-SSOP New 详细
TPS61071TDDCRQ1 TI TSOT-23-6 New 详细
LM3103MHX/NOPB TI 16-HTSSOP New 详细
TPS61029QDPNRQ1 TI 10-VSON (3x3) New 详细
SN761683BDA TI 32-TSSOP New 详细
ISO1050EVM TI New 详细
RC4136N TI 14-PDIP New 详细
TPS2047BDRG4 TI 16-SOIC New 详细
TPS70960DBVT TI SOT-23-5 New 详细
RI-INL-W007-40 TI New 详细
LM4991MAX/NOPB TI 8-SOIC New 详细
TPS3851G18SDRBT TI 8-SON (3x3) New 详细
TLV3402CD TI 8-SOIC New 详细
ADS7951SBDBT TI 30-TSSOP New 详细