产品系列
CSD86336Q3D
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : NexFET?
Part Status : Active
FET Type : 2 N-Channel (Half Bridge)
FET Feature : Logic Level Gate, 5V Drive
Drain to Source Voltage (Vdss) : 25V
Current - Continuous Drain (Id) @ 25°C : 20A (Ta)
Rds On (Max) @ Id, Vgs : 9.1 mOhm @ 20A, 5V, 3.4 mOhm @ 20A, 5V
Vgs(th) (Max) @ Id : 1.9V @ 250μA, 1.6V @ 250μA
Gate Charge (Qg) (Max) @ Vgs : 3.8nC @ 45V, 7.4nC @ 45V
Input Capacitance (Ciss) (Max) @ Vds : 494pF @ 12.5V, 970pF @ 12.5V
Power - Max : 6W
Operating Temperature : -55°C ~ 125°C
Mounting Type : Surface Mount
Package / Case : 8-PowerTDFN
Supplier Device Package : 8-VSON (3.3x3.3)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| MSP430G2101IPW14R | TI | 14-TSSOP | New | 详细 | |
| TMP75AIDGKRG4 | TI | 8-VSSOP | New | 详细 | |
| CD74HC4075NSR | TI | 14-SOP | New | 详细 | |
| LM76003RNPT | TI | 30-WQFN (6x4) | New | 详细 | |
| DP-EXPANSION-EVM | TI | New | 详细 | ||
| TMS320C5421GGUR200 | TI | 144-BGA MICROSTAR (12x12) | New | 详细 | |
| LP38690SDX-1.8 | TI | 6-WSON (3x3) | New | 详细 | |
| SN74ALVCH32244KR | TI | 96-LFBGA (13.5x5.5) | New | 详细 | |
| SN75LBC180RSARG4 | TI | 16-QFN (4x4) | New | 详细 | |
| THS4012IDRG4 | TI | 8-SOIC | New | 详细 | |
| UC382TDTR-2G3 | TI | DDPAK/TO-263-5 | New | 详细 | |
| CD74HC10M | TI | 14-SOIC | New | 详细 | |
| TPS386000QRGPRQ1 | TI | 20-QFN (4x4) | New | 详细 | |
| BQ2954SNTR | TI | 16-SOIC | New | 详细 | |
| TPS728185295YZUR | TI | 5-DSBGA | New | 详细 | |
| CDCVF857RHAR | TI | 40-VQFN (6x6) | New | 详细 | |
| SN74AUC1G125DCKR | TI | SC-70-5 | New | 详细 | |
| TPS53515RVER | TI | 28-VQFN-CLIP (4.5x3.5) | New | 详细 | |
| INA199C2DCKR | TI | SC-70-6 | New | 详细 | |
| TPS3851H50EDRBT | TI | 8-SON (3x3) | New | 详细 |
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