产品系列

罗斌森
  • CSD86311W1723

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : NexFET?
    Part Status : Active
    FET Type : 2 N-Channel (Dual)
    FET Feature : Logic Level Gate
    Drain to Source Voltage (Vdss) : 25V
    Current - Continuous Drain (Id) @ 25°C : 4.5A
    Rds On (Max) @ Id, Vgs : 39 mOhm @ 2A, 8V
    Vgs(th) (Max) @ Id : 1.4V @ 250μA
    Gate Charge (Qg) (Max) @ Vgs : 4nC @ 4.5V
    Input Capacitance (Ciss) (Max) @ Vds : 585pF @ 12.5V
    Power - Max : 1.5W
    Operating Temperature : -55°C ~ 150°C (TJ)
    Mounting Type : Surface Mount
    Package / Case : 12-UFBGA, DSBGA
    Supplier Device Package : 12-DSBGA

极速报价

型号
品牌 封装 批号 查看
LM2902KVQDRG4Q1 TI 14-SOIC New 详细
PTH08T255WAZ TI New 详细
DAC7718SPAG TI 64-TQFP (10x10) New 详细
LM3S1608-IBZ50-A2T TI 108-BGA (10x10) New 详细
TLC2254AIN TI 14-PDIP New 详细
DAC3482IRKD25 TI 88-WQFN-MR (9x9) New 详细
UC2577TDTR-ADJ TI DDPAK/TO-263-5 New 详细
CD74HC151E TI 16-PDIP New 详细
DCP022415DU TI 12-SOP New 详细
UCC28220QDRQ1 TI 16-SOIC New 详细
TPS25741ARSMT TI 32-VQFN (4x4) New 详细
TPS2321IPW TI 16-TSSOP New 详细
TMS320C6412AZDK6 TI 548-FCBGA (23x23) New 详细
LMX5453SM/NOPB TI New 详细
LM3671LC-1.6EV TI New 详细
CD74HCT688E TI New 详细
UCD9244ARGCR TI 64-VQFN (9x9) New 详细
TPIC8101EVM TI New 详细
DAC8162SDSCT TI 10-WSON (3x3) New 详细
LP3986BL-3131/NOPB TI 8-μSMD (1.57x1.57) New 详细