产品系列

罗斌森
  • CSD85302L

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : NexFET?
    Part Status : Active
    FET Type : 2 N-Channel (Dual) Common Drain
    FET Feature : Standard
    Gate Charge (Qg) (Max) @ Vgs : 7.8nC @ 4.5V
    Power - Max : 1.7W
    Operating Temperature : -55°C ~ 150°C (TJ)
    Mounting Type : Surface Mount
    Package / Case : 4-XFLGA
    Supplier Device Package : 4-Picostar (1.31x1.31)

极速报价

型号
品牌 封装 批号 查看
EVM430-F6736 TI New 详细
LP8860NQVFPRQ1 TI 32-HLQFP (7x7) New 详细
TLV3401CDBVT TI SOT-23-5 New 详细
X66AK2E05XABD25 TI 1089-FCBGA (27x27) New 详细
CDCEL925PW TI 16-TSSOP New 详细
TPS728120150DRVT TI 6-SON (2x2) New 详细
SN65HVD1473DGS TI 10-VSSOP New 详细
TMS320C6474FZUN8 TI 561-FCBGA (23x23) New 详细
TLV1117-25CDCYR TI SOT-223-4 New 详细
TLV62085EVM-764 TI New 详细
LP2989AIMM-5.0 TI 8-VSSOP New 详细
LM3478MMX/NOPB TI 8-VSSOP New 详细
UCC3807D-2 TI 8-SOIC New 详细
TLV70509YFPR TI 4-DSBGA New 详细
SN74ACT3631-20PCB TI 120-HLQFP (14x14) New 详细
UCC2912PWPR TI 24-HTSSOP New 详细
LM317AEMPX/NOPB TI SOT-223-4 New 详细
CD74HC4511M96 TI 16-SOIC New 详细
CSD17579Q3A TI 8-VSONP (3x3.15) New 详细
LM9070S/NOPB TI DDPAK/TO-263-7 New 详细