罗斌森
  • DAC60508MYZFR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Number of Bits : 12
    Number of D/A Converters : 8
    Settling Time : 5μs (Typ)
    Output Type : Voltage - Buffered
    Differential Output : No
    Data Interface : SPI
    Reference Type : External, Internal
    Voltage - Supply, Analog : 2.7V ~ 5.5V
    Voltage - Supply, Digital : 1.7V ~ 5.5V
    INL/DNL (LSB) : ±0.5, ±0.5
    Architecture : R-2R
    Operating Temperature : -40°C ~ 125°C (TA)
    Package / Case : 16-UFBGA, DSBGA
    Supplier Device Package : 16-DSBGA
    Mounting Type : Surface Mount

极速报价

型号
品牌 封装 批号 查看
LM3630EVM TI New 详细
ISO7640FMDW TI 16-SOIC New 详细
SN74AHCT573PWR TI 20-TSSOP New 详细
TPS3851H30SQDRBRQ1 TI 8-SON (3x3) New 详细
ADS5296AEVM TI New 详细
LP3985IM5-285/NOPB TI SOT-23-5 New 详细
EM430F6137RF900 TI New 详细
PAMC1304M25DW TI 16-SOIC New 详细
CD74HCT7046AM TI 16-SOIC New 详细
LP3971SQ-2G16/NOPB TI 40-WQFN (5x5) New 详细
LM124DG4 TI 14-SOIC New 详细
UC2526AQG3 TI 20-PLCC (9x9) New 详细
LM32CIMT/NOPB TI 14-TSSOP New 详细
TPS610996YFFT TI 6-DSBGA New 详细
SN74HC05DBRG4 TI 14-SSOP New 详细
CC110LRGPT TI New 详细
DAC7551TDRNRQ1 TI 12-USON (3x2) New 详细
TL431IPKG3 TI SOT-89-3 New 详细
UC3705T TI TO-220-5 New 详细
CY74FCT245TQCT TI 20-SSOP/QSOP New 详细