产品系列
DAC38RF96IAAV
- Manufacturer : Texas Instruments
Packaging : Tray
Alternate Packaging
Series : *
Part Status : Active
Package / Case : 144-FBGA, FCBGA
Supplier Device Package : 144-FCBGA (10x10)
Mounting Type : Surface Mount
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| LM2937ESX-15 | TI | DDPAK/TO-263-3 | New | 详细 | |
| OPA2345UA | TI | 8-SOIC | New | 详细 | |
| TLC2274AMDG4 | TI | 14-SOIC | New | 详细 | |
| LM385BDG4-1-2 | TI | 8-SOIC | New | 详细 | |
| SN74AHCT02DBR | TI | 14-SSOP | New | 详细 | |
| TPS3851H25SQDRBRQ1 | TI | 8-SON (3x3) | New | 详细 | |
| TSB41BA3BTPFPEP | TI | 80-HTQFP (12x12) | New | 详细 | |
| TLC27M4ACDR | TI | 14-SOIC | New | 详细 | |
| TL071IDR | TI | 8-SOIC | New | 详细 | |
| LMS1585ACSX-1.5 | TI | DDPAK/TO-263-3 | New | 详细 | |
| TMP103GYFFR | TI | 4-DSBGA (1x1) | New | 详细 | |
| SN74LVC16245AZRDR | TI | 54-BGA MICROSTAR JUNIOR (8.0x5.5) | New | 详细 | |
| TPS70925QDRVRQ1 | TI | 6-SON (2x2) | New | 详细 | |
| BQ7693007DBT | TI | 30-TSSOP | New | 详细 | |
| MDL-IDM | TI | New | 详细 | ||
| BQ4013MA-120 | TI | 32-DIP Module (18.42x42.8) | New | 详细 | |
| TPS2206ADAP | TI | 32-HTSSOP | New | 详细 | |
| TPS72118MDBVREP | TI | SOT-23-5 | New | 详细 | |
| SN74HC14APWR | TI | 14-TSSOP | New | 详细 | |
| UCC2893PW | TI | 16-TSSOP | New | 详细 |
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