产品系列
产品系列
CSD17309Q3
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : NexFET?
Part Status : Active
FET Type : N-Channel
Technology : MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss) : 30V
Current - Continuous Drain (Id) @ 25°C : 20A (Ta), 60A (Tc)
Drive Voltage (Max Rds On, Min Rds On) : 3V, 8V
Rds On (Max) @ Id, Vgs : 5.4 mOhm @ 18A, 8V
Vgs(th) (Max) @ Id : 1.7V @ 250μA
Gate Charge (Qg) (Max) @ Vgs : 10nC @ 4.5V
Vgs (Max) : +10V, -8V
Input Capacitance (Ciss) (Max) @ Vds : 1440pF @ 15V
Power Dissipation (Max) : 2.8W (Ta)
Operating Temperature : -55°C ~ 150°C (TJ)
Mounting Type : Surface Mount
Supplier Device Package : 8-VSON-CLIP (3.3x3.3)
Package / Case : 8-PowerTDFN
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| LP38693SD-ADJ/NOPB | TI | 6-WSON (3x3) | New | 详细 | |
| CDCV850IDGG | TI | 48-TSSOP | New | 详细 | |
| LP3876ET-3.3 | TI | TO-220-5 | New | 详细 | |
| TLC2274CN | TI | 14-PDIP | New | 详细 | |
| ADS1260BIRHBT | TI | 32-VQFN (5x5) | New | 详细 | |
| TMS320C6414TBCLZA6 | TI | 532-FC/CSP (23x23) | New | 详细 | |
| TPA6011A4PWP | TI | 24-HTSSOP | New | 详细 | |
| SN74CBT3126PW | TI | 14-TSSOP | New | 详细 | |
| AM3352BZCZD30 | TI | 324-NFBGA(15x15) | New | 详细 | |
| TLV70022DDCT | TI | SOT-23-5 | New | 详细 | |
| DCV012415DP | TI | 7-PDIP | New | 详细 | |
| DRV8830DGQR | TI | 10-MSOP-PowerPad | New | 详细 | |
| LM3S601-IGZ50-C2 | TI | 48-VQFN (7x7) | New | 详细 | |
| ADS42B49IRGCT | TI | 64-VQFN (9x9) | New | 详细 | |
| LP2985AITP-1.8/NOPB | TI | 5-DSBGA | New | 详细 | |
| SN74ABT16853DLR | TI | 56-SSOP | New | 详细 | |
| CC1200RHBT | TI | New | 详细 | ||
| TSB41AB3PFP | TI | 80-HTQFP (12x12) | New | 详细 | |
| TPS60240DGKR | TI | 8-VSSOP | New | 详细 | |
| LM2931AMX-5.0/NOPB | TI | 8-SOIC | New | 详细 |
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