产品系列
产品系列
CSD17309Q3
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : NexFET?
Part Status : Active
FET Type : N-Channel
Technology : MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss) : 30V
Current - Continuous Drain (Id) @ 25°C : 20A (Ta), 60A (Tc)
Drive Voltage (Max Rds On, Min Rds On) : 3V, 8V
Rds On (Max) @ Id, Vgs : 5.4 mOhm @ 18A, 8V
Vgs(th) (Max) @ Id : 1.7V @ 250μA
Gate Charge (Qg) (Max) @ Vgs : 10nC @ 4.5V
Vgs (Max) : +10V, -8V
Input Capacitance (Ciss) (Max) @ Vds : 1440pF @ 15V
Power Dissipation (Max) : 2.8W (Ta)
Operating Temperature : -55°C ~ 150°C (TJ)
Mounting Type : Surface Mount
Supplier Device Package : 8-VSON-CLIP (3.3x3.3)
Package / Case : 8-PowerTDFN
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| INA199A1DCKR | TI | SC-70-6 | New | 详细 | |
| TPS22924DYZPR | TI | 6-DSBGA, 6-WCSP (1.4x0.9) | New | 详细 | |
| SN74LV74ADGVR | TI | New | 详细 | ||
| ADS1292RIPBS | TI | 32-TQFP (5x5) | New | 详细 | |
| SN74ABT162823ADLR | TI | New | 详细 | ||
| ADS1148QPWRQ1 | TI | 28-TSSOP | New | 详细 | |
| SN74AUP2G14DCKR | TI | SC-70-6 | New | 详细 | |
| LM211PG4 | TI | 8-PDIP | New | 详细 | |
| TLV8801DBVT | TI | SOT-23-5 | New | 详细 | |
| SN74ABT16863DLR | TI | 56-SSOP | New | 详细 | |
| LP3965ESX-3.3/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| RM46L840ZWTT | TI | 337-NFBGA (16x16) | New | 详细 | |
| OPA354AIDBVR | TI | SOT-23-5 | New | 详细 | |
| SN74AHCT139DR | TI | 16-SOIC | New | 详细 | |
| TPS3110E09DBVT | TI | SOT-23-6 | New | 详细 | |
| BQ29705DSER | TI | 6-WSON (1.5x1.5) | New | 详细 | |
| LM323K STEEL/NOPB | TI | TO-3-2 | New | 详细 | |
| TPS61099YFFR | TI | 6-DSBGA | New | 详细 | |
| LM3S2793-IQC80-C5 | TI | 100-LQFP (14x14) | New | 详细 | |
| 74ACT11373NSR | TI | 24-SO | New | 详细 |
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