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  • CC2541F256RHAT

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Type : TxRx + MCU
    RF Family/Standard : Bluetooth
    Protocol : Bluetooth v4.0
    Modulation : GFSK, MSK
    Frequency : 2.4GHz
    Data Rate (Max) : 2Mbps
    Power - Output : 0dBm
    Sensitivity : -99dBm
    Memory Size : 256kB Flash, 8kB RAM
    Serial Interfaces : I2C, SPI, USART
    GPIO : 23
    Voltage - Supply : 2V ~ 3.6V
    Current - Receiving : 17.9mA ~ 20.2mA
    Current - Transmitting : 16.8mA ~ 18.2mA
    Operating Temperature : -40°C ~ 85°C
    Mounting Type : Surface Mount
    Package / Case : 40-VFQFN Exposed Pad
    Supplier Device Package : 40-VQFN (6x6)

极速报价

型号
品牌 封装 批号 查看
UCC3570DTRG4 TI 14-SOIC New 详细
SN75LVDS83DGG TI 56-TSSOP New 详细
CCBTLV3257MPWREP TI 16-TSSOP New 详细
LP3891ES-1.8/NOPB TI DDPAK/TO-263-5 New 详细
TLC25M4CDRG4 TI 14-SOIC New 详细
BQ2000PWR TI 8-TSSOP New 详细
SN74AUP1T57DBVR TI SOT-23-6 New 详细
LF444CM/NOPB TI 14-SOIC New 详细
AIC111RHBRG4 TI 32-VQFN (5x5) New 详细
CD74ACT32QM96Q1 TI 14-SOIC New 详细
TPS63050RMWT TI 12-VQFN-HR (2.5x2.5) New 详细
LP2986IMMX-3.0/NOPB TI 8-VSSOP New 详细
LM2738YMYX/NOPB TI 8-MSOP-EP New 详细
SN75ALS193DR TI 16-SOIC New 详细
PT6724N TI New 详细
TLV73311PDQNR TI 4-X2SON (1x1) New 详细
TPS3839K50DQNR TI 4-X2SON (1x1) New 详细
TPS79301DBVT TI SOT-23-6 New 详细
TLV70033DSET TI 6-WSON (1.5x1.5) New 详细
THS7360IPWR TI 20-TSSOP New 详细