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罗斌森
  • BQ24093DGQR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Active
    Mounting Type : Surface Mount
    Package / Case : 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad
    Supplier Device Package : 10-MSOP-PowerPad

极速报价

型号
品牌 封装 批号 查看
TSM102IPW TI 16-TSSOP New 详细
TPS2104D TI 8-SOIC New 详细
SN74ABT534APWG4 TI New 详细
PT5044M TI New 详细
LMR14050SQDDARQ1 TI 8-SO PowerPad New 详细
TPS2041BDBVT TI SOT-23-5 New 详细
DLPA200PFP TI 80-HTQFP (12x12) New 详细
CSD88599Q5DCT TI 22-VSON-CLIP (5x6) New 详细
LP2987IMM-2.5 TI 8-VSSOP New 详细
LM4041DILPR TI TO-92-3 New 详细
TLC2274IN TI 14-PDIP New 详细
TPS70802PWPRG4 TI 20-HTSSOP New 详细
TPS7B6733QPWPRQ1 TI 20-HTSSOP New 详细
LP2980IM5X-1.8/NOPB TI SOT-23-5 New 详细
SN74ACT74PW TI New 详细
TLV3702CD TI 8-SOIC New 详细
LPV321IDBVRG4 TI SOT-23-5 New 详细
SN74LVC1G80YEPR TI New 详细
CD74AC245M TI 20-SOIC New 详细
LP3879MRX-1.2/NOPB TI 8-SO PowerPad New 详细
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