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  • BQ24093DGQR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Active
    Mounting Type : Surface Mount
    Package / Case : 10-TFSOP, 10-MSOP (0.118", 3.00mm Width) Exposed Pad
    Supplier Device Package : 10-MSOP-PowerPad

极速报价

型号
品牌 封装 批号 查看
LM5109BMAX/NOPB TI 8-SOIC New 详细
TVP5147M1PFPR TI 80-HTQFP (12x12) New 详细
TMS320C6413ZTS500 TI 288-FCBGA (23x23) New 详细
CD4098BM TI 16-SOIC New 详细
MSC1211Y2PAGRG4 TI 64-TQFP (10x10) New 详细
LM2574HVM-5.0/NOPB TI 14-SOIC New 详细
SN74AHC174PWR TI New 详细
TLV7163030PDPQR TI 6-X2SON (1.2x1.2) New 详细
TLC5951DAP TI 38-HTSSOP New 详细
TLV61225DCKR TI SC-70-6 New 详细
LM3S9781-IBZ80-C5 TI 108-BGA (10x10) New 详细
BQ24600RVAR TI 16-VQFN (3.5x3.5) New 详细
SN65MLVD080DGG TI 64-TSSOP New 详细
LM2940CSX-12 TI DDPAK/TO-263-3 New 详细
DAC7664YBRG4 TI 64-LQFP (10x10) New 详细
TLV73311PDBVR TI SOT-23-5 New 详细
SN74AHCT16245DGGR TI 48-TSSOP New 详细
LM431ACM/NOPB TI 8-SOIC New 详细
TL7770-12CDW TI 16-SOIC New 详细
SN74CBTD3861DWR TI 24-SOIC New 详细