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  • BUF08630RGWT

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Applications : TFT-LCD Panels: VCOM Driver
    Output Type : Rail-to-Rail
    Number of Circuits : 8
    Slew Rate : 45V/μs
    Current - Supply : 940μA
    Current - Output / Channel : 300mA
    Voltage - Supply, Single/Dual (±) : 9V ~ 20V
    Mounting Type : Surface Mount
    Package / Case : 20-VQFN Exposed Pad
    Supplier Device Package : 20-VQFN (5x5)

极速报价

型号
品牌 封装 批号 查看
CD74HCT299M TI 20-SOIC New 详细
TRS232DR TI 16-SOIC New 详细
LM3671MFX-1.6/NOPB TI SOT-23-5 New 详细
LP2988ILD-2.5 TI 8-WSON (4x4) New 详细
SN74LS47NSR TI 16-SO New 详细
LM3450MT/NOPB TI 16-TSSOP New 详细
SN74LVC04APWRG4 TI 14-TSSOP New 详细
DS90C383MTD/NOPB TI 56-TSSOP New 详细
LP2988IM-2.5 TI 8-SOIC New 详细
LMS1585ACS-1.5 TI DDPAK/TO-263-3 New 详细
LP2992AIM5X-3.3/NOPB TI SOT-23-5 New 详细
LM26LVCISD-110/NOPB TI 6-WSON (2.2x2.5) New 详细
VSP3200Y/2KG4 TI 48-LQFP (7x7) New 详细
TPS3823-50DBVR TI SOT-23-5 New 详细
REF5020MDREP TI 8-SOIC New 详细
SN74CBTS3384DWRE4 TI 24-SOIC New 详细
TXS0104EQPWRQ1 TI 14-TSSOP New 详细
LP3966ESX-1.8/NOPB TI DDPAK/TO-263-5 New 详细
TPS3306-18D TI 8-SOIC New 详细
UCC27532QDBVRQ1 TI SOT-23-6 New 详细