产品系列
产品系列
0804MC
- Manufacturer : Texas Instruments
Packaging : Tray
Part Status : Active
Type : Transistor, TO-3
Number of Positions or Pins (Grid) : 8 (Oval)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0μin (0.76μm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0μin (5.08μm)
Contact Material - Post : Brass
Housing Material : Polyester, Glass Filled
Operating Temperature : -55°C ~ 150°C
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| PCI1510GGU | TI | 144-BGA MICROSTAR (12x12) | New | 详细 | |
| SN74221N | TI | 16-PDIP | New | 详细 | |
| TLV2373IDR | TI | 14-SOIC | New | 详细 | |
| TPS62102D | TI | 8-SOIC | New | 详细 | |
| MSC1214Y2PAGTG4 | TI | 64-TQFP (10x10) | New | 详细 | |
| DAC8534IPW | TI | 16-TSSOP | New | 详细 | |
| SN74LVC2G17YZPR | TI | 6-DSBGA, 6-WCSP (1.4x0.9) | New | 详细 | |
| SN74F21N | TI | 14-PDIP | New | 详细 | |
| TLV2461AQDRG4Q1 | TI | 8-SOIC | New | 详细 | |
| SN74AC573N | TI | 20-PDIP | New | 详细 | |
| TMS320C6713BGDP225 | TI | 272-BGA (27x27) | New | 详细 | |
| LP2967ITPX-1825/NOPB | TI | 8-μSMD (1.41x1.95) | New | 详细 | |
| SN74HC373ADBRG4 | TI | 20-SSOP | New | 详细 | |
| LM2672MX-12 | TI | 8-SOIC | New | 详细 | |
| TLV320AIC3104EVM-K | TI | New | 详细 | ||
| SN65LVDS16DRFT | TI | 8-WSON (2x2) | New | 详细 | |
| SN74LVC1G04YZVR | TI | 4-DSBGA (0.88x0.88) | New | 详细 | |
| OMAP3530ECUS | TI | 423-FCBGA (16x16) | New | 详细 | |
| BQ24730RGFT | TI | 40-VQFN-EP (5x7) | New | 详细 | |
| CDC960DLR | TI | 48-SSOP | New | 详细 |
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