产品系列
产品系列
0804MC
- Manufacturer : Texas Instruments
Packaging : Tray
Part Status : Active
Type : Transistor, TO-3
Number of Positions or Pins (Grid) : 8 (Oval)
Contact Finish - Mating : Gold
Contact Finish Thickness - Mating : 30.0μin (0.76μm)
Contact Material - Mating : Beryllium Copper
Mounting Type : Through Hole
Features : Closed Frame
Termination : Solder
Contact Finish - Post : Tin
Contact Finish Thickness - Post : 200.0μin (5.08μm)
Contact Material - Post : Brass
Housing Material : Polyester, Glass Filled
Operating Temperature : -55°C ~ 150°C
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| FPC402RHUT | TI | 56-WQFN (5x11) | New | 详细 | |
| SN74ALS870NSRE4 | TI | 24-SO | New | 详细 | |
| LMS8117AMPX-3.3/NOPB | TI | SOT-223 | New | 详细 | |
| PCM3006T/2K | TI | 24-SSOP | New | 详细 | |
| LP5900SD-2.5/NOPB | TI | 6-WSON (2.2x2.5) | New | 详细 | |
| TLV3701CDBVT | TI | SOT-23-5 | New | 详细 | |
| CY74FCT240TSOCT | TI | 20-SOIC | New | 详细 | |
| TXB0304EVM | TI | New | 详细 | ||
| LM5032MTCX/NOPB | TI | 16-TSSOP | New | 详细 | |
| TL431BIDBVR | TI | SOT-23-5 | New | 详细 | |
| TLC2274CPW | TI | 14-TSSOP | New | 详细 | |
| LP2985AITPX-1.8/NOPB | TI | 5-DSBGA | New | 详细 | |
| SN74S32NSRG4 | TI | 14-SOP | New | 详细 | |
| OPA4137U/2K5 | TI | 14-SOIC | New | 详细 | |
| TSB81BA3DPFPG4 | TI | 80-HTQFP (12x12) | New | 详细 | |
| DSD1608PAHR | TI | 52-TQFP (10x10) | New | 详细 | |
| TPS62007EVM-168 | TI | New | 详细 | ||
| TM4C129XNCZADI3R | TI | 212-NFBGA (10x10) | New | 详细 | |
| TPIC6B595N | TI | 20-PDIP | New | 详细 | |
| LM3S5D91-IQC80-A1T | TI | 100-LQFP (14x14) | New | 详细 |
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