罗斌森
  • 2SC3332R

  • Manufacturer : ON Semiconductor
    Packaging : Bulk
    Part Status : Obsolete
    Mounting Type : Through Hole
    Package / Case : TO-226-3, TO-92-3 (TO-226AA)
    Supplier Device Package : 3-NP

极速报价

型号
品牌 封装 批号 查看
M74VHC1GT00DTT1G ON 5-TSOP New 详细
NUF2101MT1 ON New 详细
74ACT04MTC ON 14-TSSOP New 详细
NTLUD3A50PZTAG ON 6-UDFN (2x2) New 详细
H11C53S ON 6-SMD New 详细
NIS6201DR2G ON 8-SOIC New 详细
MOC3011FM ON 6-SMD New 详细
MAX810MTR ON SOT-23-3 (TO-236) New 详细
H11N1SM ON 6-SMD New 详细
NLAST44599DTG ON 16-TSSOP New 详细
NTD18N06T4G ON DPAK New 详细
LM258DR2G ON 8-SOIC New 详细
FDN327N ON SuperSOT-3 New 详细
BC859BLT1 ON SOT-23-3 (TO-236) New 详细
NCP1271P65G ON 7-PDIP New 详细
FNA23060 ON New 详细
LV8805SV-MPB-H ON 20-SSOPJ New 详细
MC74VHCT373ADTRG ON 20-TSSOP New 详细
BDV64BG ON TO-247 New 详细
BCX18LT1G ON SOT-23-3 (TO-236) New 详细