罗斌森
  • NCP6336BFCCT1G

  • Manufacturer : ON Semiconductor
    Packaging : Tape & Reel (TR)
    Alternate Packaging
    Part Status : Not For New Designs
    Mounting Type : Surface Mount
    Package / Case : 20-UFBGA, WLCSP
    Supplier Device Package : 20-WLCSP (1.62x2.02)

极速报价

型号
品牌 封装 批号 查看
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NCS2200SN1T1 ON 5-TSOP New 详细