罗斌森
  • NCP361MUTBG

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Technology : Mixed Technology
    Number of Circuits : 1
    Applications : General Purpose
    Mounting Type : Surface Mount
    Package / Case : 6-UDFN Exposed Pad
    Supplier Device Package : 6-UDFN (2x2)

极速报价

型号
品牌 封装 批号 查看
MC79L12ACPRP ON TO-92-3 New 详细
MC74LVX125DTG ON 14-TSSOP New 详细
MBRF30L45CTG ON TO-220FP New 详细
CD4049UBCM ON 16-SOIC New 详细
H11AG2 ON 6-DIP New 详细
FJX3010RTF ON SC-70 (SOT323) New 详细
KA2803BDTF ON 8-SOP New 详细
MSD601-ST1G ON SC-59 New 详细
LM2904MX ON 8-SOIC New 详细
NCL30060LED1GEVB ON New 详细
MBR4045PTG ON SOT-93 New 详细
NTMS4706NR2 ON 8-SOIC New 详细
74LCX126MX ON 14-SOIC New 详细
LC709501A06GEVB ON New 详细
MT9J003I12STCVH-GEVB ON New 详细
NCV59152DSADJR4G ON D2PAK-5 New 详细
2SC5964-TD-H ON PCP New 详细
NCP81218MNTXG ON New 详细
NCP1075NONGEVB ON New 详细
NCV8668ABD250R2G ON 14-SOIC New 详细