罗斌森
  • NCP361MUTBG

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Part Status : Active
    Technology : Mixed Technology
    Number of Circuits : 1
    Applications : General Purpose
    Mounting Type : Surface Mount
    Package / Case : 6-UDFN Exposed Pad
    Supplier Device Package : 6-UDFN (2x2)

极速报价

型号
品牌 封装 批号 查看
AR0234ATSM00XUEAH3-GEVB ON New 详细
LM833DG ON 8-SOIC New 详细
MC14070BCPG ON 14-PDIP New 详细
FDP8442-F085 ON TO-220-3 New 详细
HRFZ44N ON TO-220-3 New 详细
6585_2N4209 ON Die New 详细
1N5232B_T50R ON DO-35 New 详细
MC7815CD2T ON D2PAK New 详细
NCP502SQ15T1 ON SC-88A (SC-70-5/SOT-353) New 详细
74ACTQ657SPC ON 24-PDIP New 详细
FOD2711SDV ON 8-SMD New 详细
NCP3218MNR2G ON 48-QFN (6x6) New 详细
MC74HCT04ADTR2 ON 14-TSSOP New 详细
1SMA22AT3 ON SMA New 详细
TIP116TU ON TO-220-3 New 详细
BC214L_J35Z ON TO-92-3 New 详细
FL7930BM ON 8-SOP New 详细
DM74AS158M ON 16-SOIC New 详细
FCH104N60F-F085 ON TO-247 New 详细
74VCX16839MTD ON 56-TSSOP New 详细