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罗斌森

NCP115AMX330TCG
Manufacturer : ON Semiconductor
Packaging : Cut Tape (CT)
Alternate Packaging
Series : *
Part Status : Active

H11AA814A300W	ON	4-DIP	New	详细
型号	品牌	封装	批号	查看
74LVX157SJX	ON	16-SOP	New	详细
MC78M08ACDTRK	ON	DPAK	New	详细
2SK3703	ON	TO-220ML	New	详细
NCV86604BDT33RKG	ON	DPAK-5	New	详细
MC74VHC574DTR2G	ON		New	详细
CNY17F1TM	ON	6-DIP	New	详细
NSR20F30QNXT5G	ON	2-DSN (1.6x.80)	New	详细
MC78L09ABPRP	ON	TO-92-3	New	详细
FODM3022R2-NF098	ON	4-SMD	New	详细
ML4812CQ	ON	20-PLCC (9x9)	New	详细
NCV612SQ27T1G	ON	SC-88A (SC-70-5/SOT-353)	New	详细
NCV78L05ABDG	ON	8-SOIC	New	详细
74VHC373MX	ON	20-SOIC	New	详细
MMBZ5243B	ON	SOT-23-3	New	详细
FLZ15VB	ON	SOD-80	New	详细
LA6565VR-TLM-E	ON	44-SSOP	New	详细
MC33501SNT1G	ON	5-TSOP	New	详细
SZMMSZ5227BT1G	ON	SOD-123	New	详细
UC3844BD1R2	ON	8-SOIC	New	详细