罗斌森
  • NVMYS1D3N04CTWG

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Active
    Mounting Type : Surface Mount
    Supplier Device Package : LFPAK4 (5x6)
    Package / Case : SC-100, SOT-669

极速报价

型号
品牌 封装 批号 查看
ICTE-15RL4 ON Axial New 详细
MCR100-8RLG ON TO-92-3 New 详细
NCV8506D2T25 ON D2PAK-7 New 详细
MM74HC4051M ON 16-SOIC New 详细
NTGD3147FT1G ON 6-TSOP New 详细
BUV26G ON TO-220AB New 详细
FLZ8V2C ON SOD-80 New 详细
MM74HC540MTC ON 20-TSSOP New 详细
FUSB302BMPX ON 14-MLP (2.5x2.5) New 详细
MMSZ5221ET1 ON SOD-123 New 详细
BC547TA ON TO-92-3 New 详细
H11B1SR2M ON 6-SMD New 详细
2N4125TF ON TO-92-3 New 详细
KA2902D ON 14-SOP New 详细
HUF76419S3S ON D2PAK (TO-263AB) New 详细
FDC6327C ON SuperSOT?-6 New 详细
NM27C512V90 ON 32-PLCC (14x11.46) New 详细
BAV99_S00Z ON SOT-563 New 详细
MMBZ5267BLT1G ON SOT-23-3 (TO-236) New 详细
MC10ELT25DTG ON 8-TSSOP New 详细