罗斌森
  • NVMYS1D3N04CTWG

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Active
    Mounting Type : Surface Mount
    Supplier Device Package : LFPAK4 (5x6)
    Package / Case : SC-100, SOT-669

极速报价

型号
品牌 封装 批号 查看
1SMB5956BT3G ON SMB New 详细
KA7808ETU ON TO-220-3 New 详细
NLVHC4052ADWR2G ON New 详细
2N3415_D74Z ON TO-92-3 New 详细
NVMFD5C680NLT1G ON 8-DFN (5x6) Dual Flag (SO8FL-Dual) New 详细
FEBFMT1030_MEMS01 ON New 详细
GMC7275CA ON New 详细
MM74HC175M ON New 详细
CS4121ENF16 ON 16-DIP New 详细
NCP694DSANADJT1G ON 6-HSON New 详细
MOC3061SR2M ON 6-SMD New 详细
MC10E167FN ON 28-PLCC (11.51x11.51) New 详细
NLVHC4538ADR2G ON 16-SOIC New 详细
SBRD8835LT4G-VF01 ON DPAK New 详细
GBPC1202 ON GBPC New 详细
NBSG16MN ON 16-QFN (3x3) New 详细
MV57152 ON Bullet Profile T-1 3/4 New 详细
MC74LVX32DR2G ON 14-SOIC New 详细
CAT5115ZI-10-T3 ON New 详细
2SD1207U ON 3-MP New 详细