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OPB865N55
Manufacturer : ON Semiconductor
Packaging : Bulk
Part Status : Obsolete
Mounting Type : Through Hole
Package / Case : Module, PC Pins, Slot Type

H11D1300	ON	6-DIP	New	详细
型号	品牌	封装	批号	查看
FDB035N10A	ON	D2PAK	New	详细
MOC256R2M	ON	8-SOIC	New	详细
PN200A_D26Z	ON	TO-92-3	New	详细
NM25C04M8	ON	8-SO	New	详细
AMIS-3910XGEVB	ON		New	详细
MC74VHC244MELG	ON	SOEIAJ-20	New	详细
MC74LVX540MG	ON	SOEIAJ-20	New	详细
NUD3048MT1G	ON	6-TSOP	New	详细
CD4052BCMX	ON	16-SOIC	New	详细
FJZ945LTF	ON	SOT-623F	New	详细
NOIP1SN0480A-HEAD-BD-A-GEVK	ON		New	详细
MM74HC157MTC	ON	16-TSSOP	New	详细
P3PS550AHG-08-CR	ON	8-WDFN (2x2)	New	详细
NC7S00L6X	ON	6-MicroPak	New	详细
NTJD4401NT1	ON	SC-88/SC70-6/SOT-363	New	详细
BZX84C6V2ET3G	ON	SOT-23-3 (TO-236)	New	详细
NTD5413NT4G	ON	DPAK	New	详细
H11AA3SR2VM	ON	6-SMD	New	详细
74VHC163MTCX	ON	16-TSSOP	New	详细