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罗斌森

OPB865N55
Manufacturer : ON Semiconductor
Packaging : Bulk
Part Status : Obsolete
Mounting Type : Through Hole
Package / Case : Module, PC Pins, Slot Type

NCP1282BDR2G	ON	16-SOIC	New	详细
型号	品牌	封装	批号	查看
FDB2552	ON	TO-263AB	New	详细
MBR3045PT	ON	SOT-93	New	详细
BC212BG	ON	TO-92-3	New	详细
CAT34C02HU3IGT4A	ON	8-UDFN (2x3)	New	详细
NC7WP14L6X	ON	6-MicroPak	New	详细
NCP1606BOOSTGEVB	ON		New	详细
74F175SCX	ON		New	详细
FPF2500	ON	SOT-23-5	New	详细
NUF2900MNT1G	ON		New	详细
SA575DTBG	ON	20-TSSOP	New	详细
NCP1001PG	ON	8-PDIP	New	详细
MM74HC02MTC	ON	14-TSSOP	New	详细
NCP3335ADMADJR2G	ON	Micro8?	New	详细
FFH50US60S	ON	TO-247-2	New	详细
CD4011BCSJX	ON	14-SOP	New	详细
RFD10P03LSM	ON	TO-252-3	New	详细
FGPF4536YDTU_SN00305	ON		New	详细
P6SMB20CAT3	ON	SMB	New	详细
1SMB5940BT3	ON	SMB	New	详细