产品系列

罗斌森
  • OPB860N55

  • Manufacturer : ON Semiconductor
    Packaging : Bulk
    Part Status : Obsolete
    Mounting Type : Through Hole
    Package / Case : Module, PC Pins, Slot Type

极速报价

型号
品牌 封装 批号 查看
74F269SCX ON 24-SOP New 详细
FLZ3V3B ON SOD-80 New 详细
1N4007RL ON DO-41 New 详细
CAX810STBI-T3 ON SOT-23 New 详细
1N5359BG ON Axial New 详细
NB2308AI5HDR2G ON 16-SOIC New 详细
BC32825_J35Z ON TO-92-3 New 详细
MOCD207R2M_F132 ON 8-SOIC New 详细
MC74AC04NG ON 14-PDIP New 详细
NCP1072DIPGEVB ON New 详细
FLZ33VA ON SOD-80 New 详细
CAT24C256WI-GT3 ON 8-SOIC New 详细
HUF75345S3S ON D2PAK (TO-263AB) New 详细
NC7S02P5 ON SC-70-5 New 详细
FDB3860 ON TO-263AB New 详细
NCP308SN300T1G ON 6-TSOP New 详细
NOIV1SN016KA-GDI ON 355-μPGA New 详细
J202_D27Z ON TO-92-3 New 详细
QTLP660CIRTR ON New 详细
MC14174BDR2 ON New 详细