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罗斌森
  • VSC8584XKS-10

  • Manufacturer : Microchip Technology
    Packaging : Tray
    Part Status : Active
    Mounting Type : Surface Mount
    Package / Case : 256-BGA
    Supplier Device Package : 256-BGA (17x17)

极速报价

型号
品牌 封装 批号 查看
MCP1702-2502E/TO Microchip TO-92-3 New 详细
PL602034UMG Microchip 16-QFN (3x3) New 详细
DSC1121DI5-010.0000T Microchip New 详细
ATXMEGA16E5-MUR Microchip 32-VQFN (5x5) New 详细
DSPIC33FJ16GP101T-I/SO Microchip 18-SOIC New 详细
MIC5259-4.75BD5-TR Microchip TSOT-23-5 New 详细
MIC2876-AYMT-TR Microchip 8-TDFN (2x2) New 详细
DSC1001AE1-033.0000T Microchip New 详细
AT27C010L-45TI Microchip 32-TSOP New 详细
AT87F51RC-24AC Microchip 44-TQFP (10x10) New 详细
DSC506-03FM2 Microchip New 详细
ATSHA204A-RBHCZ-T Microchip 3-SMD New 详细
DSC1123DL2-050.0000T Microchip New 详细
PIC18F86J10-I/PT Microchip 80-TQFP (12x12) New 详细
DSC1001DE1-036.6670 Microchip New 详细
DSPIC33FJ16GS502-I/SP Microchip 28-SPDIP New 详细
MCP6546-I/MS Microchip 8-MSOP New 详细
ATTINY85-15SZ Microchip 8-SOIC New 详细
PIC18F2539-I/SO Microchip 28-SOIC New 详细
DSPIC30F2011-30I/SO Microchip 18-SOIC New 详细