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罗斌森
  • VSC8584XKS-09

  • Manufacturer : Microchip Technology
    Packaging : Tray
    Part Status : Active
    Mounting Type : Surface Mount
    Package / Case : 256-BGA
    Supplier Device Package : 256-BGA (17x17)

极速报价

型号
品牌 封装 批号 查看
PIC16C54-RC/P Microchip 18-PDIP New 详细
MIC834BM5-TR Microchip SOT-23-5 New 详细
TC54VC3002EZB Microchip TO-92-3 New 详细
PIC16F684T-I/ML Microchip 16-QFN (4x4) New 详细
ATSAM4CMS8CA-AUR Microchip 100-LQFP (14x14) New 详细
DSPIC33EP256GM706-H/MR Microchip 64-QFN (9x9) New 详细
AT28C010-15JC Microchip 32-PLCC (13.97x11.43) New 详细
PIC16C64AT-10E/PQ Microchip 44-MQFP (10x10) New 详细
MIC5210-2.5/2.7BMM TR Microchip 8-MSOP New 详细
AT93C56-10SI-2.7-T Microchip 8-SOIC New 详细
ATF16V8C-7PU Microchip 20-PDIP New 详细
ATMEGA16U2-MUR Microchip 32-VQFN (5x5) New 详细
AT28C64-20SC Microchip 28-SOIC New 详细
SY10EL32VZI Microchip 8-SOIC New 详细
PIC18F2221-I/SP Microchip 28-SPDIP New 详细
MCP120-485DI/TO Microchip TO-92-3 New 详细
DSC1121AE1-008.0000T Microchip New 详细
AT28C256-90JI Microchip 32-PLCC (13.97x11.43) New 详细
DSC1001AE1-131.0720T Microchip New 详细
AT89C55-24JC Microchip 44-PLCC (16.6x16.6) New 详细