产品系列

罗斌森
  • VSC8584XKS-09

  • Manufacturer : Microchip Technology
    Packaging : Tray
    Part Status : Active
    Mounting Type : Surface Mount
    Package / Case : 256-BGA
    Supplier Device Package : 256-BGA (17x17)

极速报价

型号
品牌 封装 批号 查看
PIC12F1501T-I/SN Microchip 8-SOIC New 详细
DSC1001DC1-125.0000T Microchip New 详细
AT90USB82-16MUR Microchip 32-VQFN (5x5) New 详细
MIC29372BU TR Microchip TO-263-5 New 详细
PIC16F18854-I/SS Microchip 28-SSOP New 详细
PIC16LF18455T-I/SS Microchip 28-SSOP New 详细
SY10E452JC-TR Microchip New 详细
PIC16LC662T-04/L Microchip 44-PLCC (16.59x16.59) New 详细
AT90LS2343-1SC Microchip 8-SOIC New 详细
PIC16F18313T-I/RF Microchip New 详细
PIC16F684-I/ST Microchip 14-TSSOP New 详细
AT29C010A-15PC Microchip 32-PDIP New 详细
ATF1504ASVL-20JC68 Microchip 68-PLCC (24.23x24.23) New 详细
AC162094 Microchip New 详细
MIC29312WT Microchip TO-220-5 New 详细
MCP4802-E/SNVAO Microchip 8-SOIC New 详细
SY10EL16VDKG Microchip 10-MSOP New 详细
ATSAME70N21B-CNT Microchip 100-TFBGA (9x9) New 详细
TC6501P045VCTTR Microchip SOT-23-5 New 详细
MIC4479YM-TR Microchip 8-SOIC New 详细