产品系列

罗斌森
  • VSC8584XKS-08

  • Manufacturer : Microchip Technology
    Packaging : Tray
    Part Status : Active
    Mounting Type : Surface Mount
    Package / Case : 256-BGA
    Supplier Device Package : 256-BGA (17x17)

极速报价

型号
品牌 封装 批号 查看
PIC18F4320-I/PT Microchip 44-TQFP (10x10) New 详细
MCP6034-E/ST Microchip 14-TSSOP New 详细
PIC18F45J10-I/PT Microchip 44-TQFP (10x10) New 详细
MIC2085-KBQS Microchip 16-QSOP New 详细
SY88933ALKI-TR Microchip 10-MSOP New 详细
SY89323LMI-TR Microchip 8-MLF? (2x2) New 详细
USB5807/KD Microchip 100-VQFN (12x12) New 详细
ATA8205P6C-TKQY Microchip 20-SSO New 详细
ATSAMS70N20A-CNT Microchip 100-TFBGA (9x9) New 详细
DSPIC33EP128MC502-E/SP Microchip 28-SPDIP New 详细
MIC708TMY-TR Microchip 8-SOIC New 详细
AT29C512-20JI Microchip 32-PLCC (13.97x11.43) New 详细
PIC18F45K40-E/PT Microchip 44-TQFP (10x10) New 详细
PIC18F2455-I/SP Microchip 28-SPDIP New 详细
PIC16C62A-20E/SP Microchip 28-SPDIP New 详细
MCP4532T-103E/MS Microchip 8-MSOP New 详细
HV860K7-G Microchip 12-QFN (3x3) New 详细
PIC16F77-E/ML Microchip 44-QFN (8x8) New 详细
MIC5203-4.5BM4 TR Microchip SOT-143 New 详细
PIC16LF19156T-I/SS Microchip 28-SSOP New 详细