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罗斌森
  • VSC8582XKS-10

  • Manufacturer : Microchip Technology
    Packaging : Tray
    Part Status : Active
    Mounting Type : Surface Mount
    Package / Case : 256-BGA
    Supplier Device Package : 256-BGA

极速报价

型号
品牌 封装 批号 查看
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AT28C64E-20PC Microchip 28-PDIP New 详细
MCP4801-E/P Microchip 8-PDIP New 详细
PIC18F26K83-I/SP Microchip 28-SPDIP New 详细
DSPIC33EP128GM310-H/PF Microchip 100-TQFP (14x14) New 详细
DSC1001CI2-018.0000T Microchip New 详细
DSC1001DI2-004.0000 Microchip New 详细
ATTINY85-15MT Microchip 20-QFN-EP (4x4) New 详细
PL685-P8-068OC-R Microchip 16-TSSOP New 详细
AT29LV040A-25TI Microchip 32-TSOP New 详细
SY10EL16VAZC TR Microchip 8-SOIC New 详细
MAQ4123YME-TRVAO Microchip 8-SOIC-EP New 详细
EMC1815T-AE/9R Microchip 10-VDFN (2.5x2) New 详细
PIC16F1575-I/JQ Microchip 16-UQFN (4x4) New 详细
MCP6482-E/MS Microchip 8-MSOP New 详细
DSC8124CI5 Microchip New 详细
93LC46BT-I/SN15KVAO Microchip 8-SOIC New 详细
ATSHA204-MAH-CZ-T Microchip 8-UDFN (2x3) New 详细