产品系列
产品系列
XC7Z045-3FFG676E
- Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq?-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM? Cortex?-A9 MPCore? with CoreSight?
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 1GHz
Primary Attributes : Kintex?-7 FPGA, 350K Logic Cells
Operating Temperature : 0°C ~ 100°C (TJ)
Package / Case : 676-BBGA, FCBGA
Supplier Device Package : 676-FCBGA (27x27)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| XC6SLX25T-2FGG484C | Xilinx | 484-FBGA (23x23) | New | 详细 | |
| XC2V2000-4FGG676I | Xilinx | 676-FBGA (27x27) | New | 详细 | |
| XC6SLX16-2FTG256I | Xilinx | 256-FTBGA (17x17) | New | 详细 | |
| XC7S50-2CSGA324C | Xilinx | 324-CSPBGA (15x15) | New | 详细 | |
| XC7A100T-3FGG484E | Xilinx | 484-FBGA (23x23) | New | 详细 | |
| XC6SLX9-2FTG256C | Xilinx | 256-FTBGA (17x17) | New | 详细 | |
| XC2V4000-5FFG1152C | Xilinx | 1152-FCBGA (35x35) | New | 详细 | |
| XA3S200-4TQG144I | Xilinx | 144-TQFP (20x20) | New | 详细 | |
| EF-DI-OBSAI-WW | Xilinx | New | 详细 | ||
| HW-SMARTLYNQ-G | Xilinx | New | 详细 | ||
| EF-DI-RSE-SITE | Xilinx | New | 详细 | ||
| XC6SLX150T-N3FGG900C | Xilinx | 900-FBGA (31x31) | New | 详细 | |
| XC2V3000-5BG728I | Xilinx | 728-MBGA (35x35) | New | 详细 | |
| XC7S100-1FGGA676C | Xilinx | 676-FPBGA (27x27) | New | 详细 | |
| XC7Z035-2FFG900E | Xilinx | 900-FCBGA (31x31) | New | 详细 | |
| XCS30-4PQ208C | Xilinx | 208-PQFP (28x28) | New | 详细 | |
| XC4025E-3HQ304C | Xilinx | 304-PQFP (40x40) | New | 详细 | |
| XC7K420T-L2FFG901E | Xilinx | 901-FCBGA (31x31) | New | 详细 | |
| XC4010XL-09PQ100C | Xilinx | 100-PQFP (20x14) | New | 详细 | |
| XC6SLX45T-3FGG484I | Xilinx | 484-FBGA (23x23) | New | 详细 |
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