产品系列
产品系列
XC7Z035-L2FFG900I
- Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq?-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM? Cortex?-A9 MPCore? with CoreSight?
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 800MHz
Primary Attributes : Kintex?-7 FPGA, 275K Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 900-BBGA, FCBGA
Supplier Device Package : 900-FCBGA (31x31)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| XC5VFX70T-1FFG1136CES | Xilinx | 1136-FCBGA (35x35) | New | 详细 | |
| XC7Z100-2FFG900I | Xilinx | 900-FCBGA (31x31) | New | 详细 | |
| XC4VFX20-11FF672C | Xilinx | 672-FCBGA (27x27) | New | 详细 | |
| XC7VX330T-1FF1761I | Xilinx | 1761-FCBGA (42.5x42.5) | New | 详细 | |
| XC7Z014S-1CLG400C | Xilinx | 400-CSPBGA (17x17) | New | 详细 | |
| XC6VLX240T-2FF1759C | Xilinx | 1759-FCBGA (42.5x42.5) | New | 详细 | |
| XC5VLX330-2FF1760C | Xilinx | 1760-FCBGA (42.5x42.5) | New | 详细 | |
| HW-SPAR3A-SK-UNI-G | Xilinx | New | 详细 | ||
| XC4005E-1TQ144C | Xilinx | 144-TQFP (20x20) | New | 详细 | |
| XC3S700A-4FTG256I | Xilinx | 256-FTBGA (17x17) | New | 详细 | |
| XCS05XL-5VQ100C | Xilinx | 100-VQFP (14x14) | New | 详细 | |
| XC17128EPD8C | Xilinx | 8-PDIP | New | 详细 | |
| XC3030-100PQ100C | Xilinx | 100-PQFP (20x14) | New | 详细 | |
| XC17S30XLVOG8C | Xilinx | 8-TSOP | New | 详细 | |
| XCV300-5FG456I | Xilinx | 456-FBGA (23x23) | New | 详细 | |
| XC2C256-7PQG208C | Xilinx | 208-PQFP (28x28) | New | 详细 | |
| XC3S1000-4FTG256C | Xilinx | 256-FTBGA (17x17) | New | 详细 | |
| XC95108-15PCG84C | Xilinx | 84-PLCC (29.31x29.31) | New | 详细 | |
| XA6SLX45T-2CSG324Q | Xilinx | 324-CSPBGA (15x15) | New | 详细 | |
| XC7Z015-2CLG485E | Xilinx | 485-CSBGA (19x19) | New | 详细 |
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