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  • XC7Z035-2FFG676E

  • Manufacturer : Xilinx Inc.
    Packaging : Tray
    Series : Zynq?-7000
    Part Status : Active
    Architecture : MCU, FPGA
    Core Processor : Dual ARM? Cortex?-A9 MPCore? with CoreSight?
    RAM Size : 256KB
    Peripherals : DMA
    Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Speed : 800MHz
    Primary Attributes : Kintex?-7 FPGA, 275K Logic Cells
    Operating Temperature : 0°C ~ 100°C (TJ)
    Package / Case : 676-BBGA, FCBGA
    Supplier Device Package : 676-FCBGA (27x27)

极速报价

型号
品牌 封装 批号 查看
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XC17S30APD8C Xilinx 8-PDIP New 详细
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XCV600E-7FG900I Xilinx 900-FBGA (31x31) New 详细
XC5VLX50-3FF324C Xilinx 324-FCBGA (19x19) New 详细
XC4010-5PQ208C Xilinx 208-PQFP (28x28) New 详细
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XC4005-5PQ208C Xilinx 208-PQFP (28x28) New 详细
XCV1600E-6FG900C Xilinx 900-FBGA (31x31) New 详细
XCS30XL-4VQ100I Xilinx 100-VQFP (14x14) New 详细
XCS10XL-4VQG100C Xilinx 100-VQFP (14x14) New 详细
XC1765EVO8C Xilinx 8-TSOP New 详细
XC6VCX195T-2FFG1156C Xilinx 1156-FCBGA (35x35) New 详细
XC2S100-5FG456I Xilinx 456-FBGA (23x23) New 详细
XC7S50-1CSGA324I Xilinx 324-CSGA (15x15) New 详细
XC4010E-1BG225C Xilinx 225-PBGA (27x27) New 详细
XC6VCX240T-2FFG1156I Xilinx 1156-FCBGA (35x35) New 详细
XC2V2000-6BGG575C Xilinx 575-BGA (31x31) New 详细
XA3S400A-4FGG400Q Xilinx 400-FBGA (21x21) New 详细