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XC7Z030-L2SBG485I
- Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq?-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM? Cortex?-A9 MPCore? with CoreSight?
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 800MHz
Primary Attributes : Kintex?-7 FPGA, 125K Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 484-FBGA
Supplier Device Package : 485-FBGA (19x19)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| XC4VLX15-12FFG676C | Xilinx | 676-FCBGA (27x27) | New | 详细 | |
| XC6SLX100-N3FG484C | Xilinx | 484-FBGA (23x23) | New | 详细 | |
| XC7Z045-2FF900E | Xilinx | 900-FCBGA (31x31) | New | 详细 | |
| XA7S50-1FGGA484Q | Xilinx | 484-FCBGA (23x23) | New | 详细 | |
| XCVU095-2FFVD1517I | Xilinx | 1517-FCBGA (40x40) | New | 详细 | |
| XC7S15-2CPGA196C | Xilinx | 196-CSPBGA (8x8) | New | 详细 | |
| XA7A50T-1CSG325Q | Xilinx | 324-CSPBGA (15x15) | New | 详细 | |
| XC4VLX25-12FFG676C | Xilinx | 676-FCBGA (27x27) | New | 详细 | |
| XA3S1000-4FGG456I | Xilinx | 456-FBGA (23x23) | New | 详细 | |
| EFR-DI-RIO-LOG-SITE | Xilinx | New | 详细 | ||
| XC7S50-1CSGA324C | Xilinx | 324-CSGA (15x15) | New | 详细 | |
| XC2VP70-5FF1517C | Xilinx | 1517-FCBGA (40x40) | New | 详细 | |
| XCS30XL-4TQG144I | Xilinx | 144-TQFP (20x20) | New | 详细 | |
| XC6VLX195T-1FFG784I | Xilinx | 784-FCBGA (29x29) | New | 详细 | |
| XC5VLX30-2FF324I | Xilinx | 324-FCBGA (19x19) | New | 详细 | |
| XC5VLX155T-2FFG1738C | Xilinx | 1738-FCBGA (42.5x42.5) | New | 详细 | |
| XC17S200AVQ44C | Xilinx | 44-VQFP (10x10) | New | 详细 | |
| XCS30-4TQ144C | Xilinx | 144-TQFP (20x20) | New | 详细 | |
| XC2VP20-5FFG1152I | Xilinx | 1152-FCBGA (35x35) | New | 详细 | |
| XC3S400-4TQG144C | Xilinx | 144-TQFP (20x20) | New | 详细 |
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