产品系列
产品系列
XC7Z030-L2FBG676I
- Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq?-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Dual ARM? Cortex?-A9 MPCore? with CoreSight?
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 800MHz
Primary Attributes : Kintex?-7 FPGA, 125K Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 676-BBGA, FCBGA
Supplier Device Package : 676-FCBGA (27x27)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| XC6VLX240T-1FF1156I | Xilinx | 1156-FCBGA (35x35) | New | 详细 | |
| EK-U1-KCU105-G | Xilinx | New | 详细 | ||
| XC2V80-4FG256I | Xilinx | 256-FBGA (17x17) | New | 详细 | |
| XC2V2000-4FF896I | Xilinx | 896-FCBGA (31x31) | New | 详细 | |
| XC4036XL-2HQ240C | Xilinx | 240-PQFP (32x32) | New | 详细 | |
| XC18V256PC20C | Xilinx | 20-PLCC (9x9) | New | 详细 | |
| XCS20XL-4TQ144C | Xilinx | 144-TQFP (20x20) | New | 详细 | |
| XC4006E-2TQ144C | Xilinx | 144-TQFP (20x20) | New | 详细 | |
| XA3S1400A-4FGG484Q | Xilinx | 484-FBGA (23x23) | New | 详细 | |
| EF-DI-IMG-ENHANCE-SITE | Xilinx | New | 详细 | ||
| XC7S50-2FTGB196C | Xilinx | 196-CSBGA (15x15) | New | 详细 | |
| XCV50-4FG256C | Xilinx | 256-FBGA (17x17) | New | 详细 | |
| XC2V1000-5BGG575C | Xilinx | 575-BGA (31x31) | New | 详细 | |
| XC5VLX50T-2FFG665I | Xilinx | 665-FCBGA (27x27) | New | 详细 | |
| XC4VSX55-10FFG1148I | Xilinx | 1148-FCPBGA (35x35) | New | 详细 | |
| XCVU080-3FFVC1517E | Xilinx | 1517-FCBGA (40x40) | New | 详细 | |
| XC7VX485T-L2FFG1158E | Xilinx | 1158-FCBGA (35x35) | New | 详细 | |
| XC5VSX240T-2FFG1738CES | Xilinx | 1738-FCBGA (42.5x42.5) | New | 详细 | |
| XCVU080-2FFVC1517I | Xilinx | 1517-FCBGA (40x40) | New | 详细 | |
| A-U250-A64G-PQ-G | Xilinx | New | 详细 |
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