罗斌森
  • XC7Z030-2FBG676E

  • Manufacturer : Xilinx Inc.
    Packaging : Tray
    Series : Zynq?-7000
    Part Status : Active
    Architecture : MCU, FPGA
    Core Processor : Dual ARM? Cortex?-A9 MPCore? with CoreSight?
    RAM Size : 256KB
    Peripherals : DMA
    Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
    Speed : 800MHz
    Primary Attributes : Kintex?-7 FPGA, 125K Logic Cells
    Operating Temperature : 0°C ~ 100°C (TJ)
    Package / Case : 676-BBGA, FCBGA
    Supplier Device Package : 676-FCBGA (27x27)

极速报价

型号
品牌 封装 批号 查看
XCZU15EG-3FFVC900E Xilinx 900-FCBGA (31x31) New 详细
XCVU065-1FFVC1517I Xilinx 1517-FCBGA (40x40) New 详细
XC5VLX110-3FFG1153C Xilinx 1153-FCBGA (35x35) New 详细
XC4020XL-1HT144C Xilinx 144-TQFP (20x20) New 详细
XC4006E-1TQ144C Xilinx 144-TQFP (20x20) New 详细
XC7A75T-2FTG256I Xilinx 256-FTBGA (17x17) New 详细
XC17S50APD8C Xilinx 8-PDIP New 详细
XC9572-15PQ100C Xilinx 100-PQFP (20x14) New 详细
XC5210-6PQ208C Xilinx 208-PQFP (28x28) New 详细
XC5VFX70T-1FFG1136I Xilinx 1136-FCBGA (35x35) New 详细
XC2V250-6FGG456C Xilinx 456-FBGA (23x23) New 详细
XCV400-4FG676C Xilinx 676-FCBGA (27x27) New 详细
XCZU9CG-2FFVC900I Xilinx 900-FCBGA (31x31) New 详细
XC2S200E-6FG456C Xilinx 456-FBGA (23x23) New 详细
DK-S6-EMBD-G Xilinx New 详细
XCS10-3VQG100C Xilinx 100-VQFP (14x14) New 详细
XC4013XL-3BG256C Xilinx 256-PBGA (27x27) New 详细
XC9572-15PCG84C Xilinx 84-PLCC (29.31x29.31) New 详细
XC2VP30-5FF896I Xilinx 896-FCBGA (31x31) New 详细
XC9536-7PC44I Xilinx 44-PLCC (16.59x16.59) New 详细