产品系列
产品系列
XC7Z007S-1CLG225I
- Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq?-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Single ARM? Cortex?-A9 MPCore? with CoreSight?
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 667MHz
Primary Attributes : Artix?-7 FPGA, 23K Logic Cells
Operating Temperature : -40°C ~ 100°C (TJ)
Package / Case : 225-LFBGA, CSPBGA
Supplier Device Package : 225-CSPBGA (13x13)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| XC5VLX85-1FF1153I | Xilinx | 1153-FCBGA (35x35) | New | 详细 | |
| XC5VLX50T-1FFG665I | Xilinx | 665-FCBGA (27x27) | New | 详细 | |
| XCV600E-7FG676C | Xilinx | 676-FCBGA (27x27) | New | 详细 | |
| XC5VFX130T-1FFG1738C | Xilinx | 1738-FCBGA (42.5x42.5) | New | 详细 | |
| XC4VLX160-11FFG1148C | Xilinx | 1148-FCPBGA (35x35) | New | 详细 | |
| XC4VLX60-11FFG1148C | Xilinx | 1148-FCPBGA (35x35) | New | 详细 | |
| XC2VP7-7FFG896C | Xilinx | 896-FCBGA (31x31) | New | 详细 | |
| XC17S100AVO8C | Xilinx | 8-TSOP | New | 详细 | |
| XCKU5P-1FFVD900E | Xilinx | 900-FCBGA (31x31) | New | 详细 | |
| XC3S4000L-4FGG900C | Xilinx | 900-FBGA (31x31) | New | 详细 | |
| XCV150-5FG256C | Xilinx | 256-FBGA (17x17) | New | 详细 | |
| XC17S100AVOG8C | Xilinx | 8-TSOP | New | 详细 | |
| XC5VLX110T-1FFG1136CES | Xilinx | 1136-FCBGA (35x35) | New | 详细 | |
| XCKU035-L1FBVA900I | Xilinx | 900-FCBGA (31x31) | New | 详细 | |
| XCV100-5BG256I | Xilinx | 256-PBGA (27x27) | New | 详细 | |
| XC9536-6VQ44C | Xilinx | 44-VQFP (10x10) | New | 详细 | |
| XC2V4000-4FFG1517I | Xilinx | 1517-FCBGA (40x40) | New | 详细 | |
| EFR-DI-10-100-EMAC-SITE | Xilinx | New | 详细 | ||
| XC2VP7-7FG456C | Xilinx | 456-FBGA (23x23) | New | 详细 | |
| XC6VLX240T-1FFG1759C | Xilinx | 1759-FCBGA (42.5x42.5) | New | 详细 |
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