产品系列
产品系列
XC7Z007S-1CLG225C
- Manufacturer : Xilinx Inc.
Packaging : Tray
Series : Zynq?-7000
Part Status : Active
Architecture : MCU, FPGA
Core Processor : Single ARM? Cortex?-A9 MPCore? with CoreSight?
RAM Size : 256KB
Peripherals : DMA
Connectivity : CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed : 667MHz
Primary Attributes : Artix?-7 FPGA, 23K Logic Cells
Operating Temperature : 0°C ~ 85°C (TJ)
Package / Case : 225-LFBGA, CSPBGA
Supplier Device Package : 225-CSPBGA (13x13)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| XC6SLX9-2CSG324C | Xilinx | 324-CSPBGA (15x15) | New | 详细 | |
| XC2S400E-6FGG456C | Xilinx | 456-FBGA (23x23) | New | 详细 | |
| XC9572-7PQ100C | Xilinx | 100-PQFP (20x14) | New | 详细 | |
| XC4VFX100-11FFG1517C | Xilinx | 1517-FCBGA (40x40) | New | 详细 | |
| XC17256EVO8C | Xilinx | 8-TSOP | New | 详细 | |
| XC9536XL-5PC44C | Xilinx | 44-PLCC (16.59x16.59) | New | 详细 | |
| XC4020E-4HQ208I | Xilinx | 208-PQFP (28x28) | New | 详细 | |
| XC2S50E-6FTG256I | Xilinx | 256-FTBGA (17x17) | New | 详细 | |
| HW-SPAR3ADDR2-DK-UNI-G | Xilinx | New | 详细 | ||
| XC7S6-1CSGA225I | Xilinx | 225-CSPBGA (13x13) | New | 详细 | |
| XC4010E-1PQ208C | Xilinx | 208-PQFP (28x28) | New | 详细 | |
| XC7S100-1FGGA484C | Xilinx | 484-FCBGA (23x23) | New | 详细 | |
| XC17S100AVO8C | Xilinx | 8-TSOP | New | 详细 | |
| XC2V3000-5FGG676I | Xilinx | 676-FBGA (27x27) | New | 详细 | |
| XC5VLX220-2FFG1760I | Xilinx | 1760-FCBGA (42.5x42.5) | New | 详细 | |
| XCKU5P-2FFVA676E | Xilinx | 676-FCBGA (27x27) | New | 详细 | |
| XC4VLX25-10FFG676I | Xilinx | 676-FCBGA (27x27) | New | 详细 | |
| XC2VP30-5FGG676C | Xilinx | 676-FBGA (27x27) | New | 详细 | |
| XC2VP50-5FF1152I | Xilinx | 1152-CFCBGA (35x35) | New | 详细 | |
| XC7S75-2FGGA484C | Xilinx | 484-FCBGA (23x23) | New | 详细 |
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