产品系列

罗斌森
  • FDG6317NZ

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : PowerTrench?
    Part Status : Active
    FET Type : 2 N-Channel (Dual)
    FET Feature : Logic Level Gate
    Drain to Source Voltage (Vdss) : 20V
    Current - Continuous Drain (Id) @ 25°C : 700mA
    Rds On (Max) @ Id, Vgs : 400 mOhm @ 700mA, 4.5V
    Vgs(th) (Max) @ Id : 1.5V @ 250μA
    Gate Charge (Qg) (Max) @ Vgs : 1.1nC @ 4.5V
    Input Capacitance (Ciss) (Max) @ Vds : 66.5pF @ 10V
    Power - Max : 300mW
    Operating Temperature : -55°C ~ 150°C (TJ)
    Mounting Type : Surface Mount
    Package / Case : 6-TSSOP, SC-88, SOT-363
    Supplier Device Package : SC-88 (SC-70-6)

极速报价

型号
品牌 封装 批号 查看
MJE15029 ON TO-220AB New 详细
FODM3021R2V ON 4-SMD New 详细
CS8363YDPS7G ON D2PAK-7 New 详细
MAN6740 ON New 详细
NCV8505D2TADJ ON D2PAK-7 New 详细
MV8832 ON T-1 3/4 New 详细
74VHCT374AMTCX ON New 详细
74VCX16821MTDX ON New 详细
BC308ABU ON TO-92-3 New 详细
MOC3162VM ON 6-DIP New 详细
ADT7461AARMZ-2REEL ON Micro8? New 详细
NJVMJD44H11T4G-VF01 ON DPAK New 详细
MC33275ST-5.0T3 ON SOT-223 New 详细
NCV494BDR2G ON 16-SOIC New 详细
FL7760AM6X ON SOT-23-6 New 详细
FAN4860UC33X ON 6-WLCSP (1.23x0.88) New 详细
J270_D27Z ON TO-92-3 New 详细
TCP-3033N-QT ON 6-QFN (1.6x1.2) New 详细
NC7SP17L6X ON 6-MicroPak New 详细
MC74VHC138DR2G ON 16-SOIC New 详细