罗斌森
  • MAX20323ENC+

  • Manufacturer : Maxim Integrated
    Packaging : Tube
    Alternate Packaging
    Part Status : Active
    Applications : Mobile Communications
    Current - Supply : 35μA ~ 170μA
    Voltage - Supply : 2.5V ~ 5.5V
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 12-XFBGA, WLPBGA
    Supplier Device Package : 12-WLP (1.70x1.32)

极速报价

型号
品牌 封装 批号 查看
MAX2650EUS+T Maxim SOT-143-4 New 详细
MAX2207EBS+T Maxim 4-UCSP (1.05x1.05) New 详细
MAX6717UKTZD6+T Maxim SOT-23-5 New 详细
DS2130+ Maxim 28-PDIP New 详细
MAX9673ETI+T Maxim 28-TQFN (5x5) New 详细
MAX1838EEE+ Maxim 16-QSOP New 详细
DS1856E-050+T&R Maxim 16-TSSOP New 详细
90-1878T+000 Maxim New 详细
DS1236AS-10+ Maxim 16-SOIC New 详细
DS1312E Maxim 20-TSSOP New 详细
MAX6426UK42+T Maxim SOT-23-5 New 详细
ICM7555IPA Maxim 8-PDIP New 详细
MAX6386XS26D3+T Maxim SC-70-4 New 详细
MAX6383XR23D1-T Maxim SC-70-3 New 详细
73S1210F-68M/F/PH Maxim 68-QFN (8x8) New 详细
DS1218+ Maxim 8-PDIP New 详细
MAX821MUS+T Maxim SOT-143-4 New 详细
MAX6388XS25D3-T Maxim SC-70-4 New 详细
MAX14827ATG+ Maxim 24-TQFN (4x4) New 详细
MAX243ESE+T Maxim 16-SOIC New 详细