罗斌森
  • MAX20323ENC+

  • Manufacturer : Maxim Integrated
    Packaging : Tube
    Alternate Packaging
    Part Status : Active
    Applications : Mobile Communications
    Current - Supply : 35μA ~ 170μA
    Voltage - Supply : 2.5V ~ 5.5V
    Operating Temperature : -40°C ~ 85°C (TA)
    Mounting Type : Surface Mount
    Package / Case : 12-XFBGA, WLPBGA
    Supplier Device Package : 12-WLP (1.70x1.32)

极速报价

型号
品牌 封装 批号 查看
MAX3100CEE+T Maxim 16-QSOP New 详细
MAX5943CEEE+ Maxim 16-QSOP New 详细
MAX4311ESD Maxim 14-SOIC New 详细
MAX3452EETE+T Maxim 16-TQFN (3x3) New 详细
DS21Q354 Maxim 256-BGA (27x27) New 详细
MAX6167BESA+T Maxim 8-SOIC New 详细
DS12C887 Maxim 24-EDIP New 详细
MAX3189EUT-T Maxim SOT-23-6 New 详细
MAX6747KA31+T Maxim SOT-23-8 New 详细
MAX44285FAWA+T Maxim 8-WLP New 详细
DG508ADY Maxim 16-SO New 详细
MAX9756ETX+T Maxim 36-TQFN (6x6) New 详细
MAX4376HASA+ Maxim 8-SOIC New 详细
MAX1030BCEG+ Maxim 24-QSOP New 详细
MAX5931LEEP+T Maxim 20-QSOP New 详细
MAX819LEPA+ Maxim 8-PDIP New 详细
MAX814TCSA+ Maxim 8-SOIC New 详细
MAX4236AESA Maxim 8-SOIC New 详细
DS2502S/T&R Maxim 8-SOIC New 详细
MAX17121ETG+ Maxim 24-TQFN (4x4) New 详细