罗斌森
  • FES6J

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Active
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
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NC7WZ17P6X_F40 ON SC-88 (SC-70-6) New 详细
H11A817A3S ON 4-SMD New 详细
NCP3066PG ON 8-PDIP New 详细
CAT1025LI-30-G ON 8-PDIP New 详细
FSL206MRLX ON 8-LSOP New 详细
NTB22N06LT4 ON D2PAK New 详细
MMBT5551LT1G ON SOT-23-3 (TO-236) New 详细
BD441 ON TO-225AA New 详细
NCS2510SNT1G ON 5-TSOP New 详细
FS8S0765RCBYDTU ON TO-220F-5L (Forming) New 详细
1N5238BTR ON DO-35 New 详细
KSE340STU ON TO-126-3 New 详细
CM1457-08CP ON New 详细
74F02SCX ON 14-SOIC New 详细
NCP1086D2TADJR4G ON D2PAK-3 New 详细