罗斌森
  • FES6J

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Active
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
FQU1N50TU ON I-PAK New 详细
MCH3383-TL-H ON SC-70FL/MCPH3 New 详细
BFL4004 ON TO-220FI(LS) New 详细
MC100EP196BMNR4G ON 32-QFN (5x5) New 详细
KAI-4021-AAA-CR-BA ON 34-CDIP New 详细
MJF15031G ON TO-220FP New 详细
1N6008B_T50R ON DO-35 New 详细
KLI-2113-12-5-A-EVK ON New 详细
FAN2564UC12X ON 4-WLCSP (1.41x0.93) New 详细
MC74VHC541DTR2G ON 20-TSSOP New 详细
MSD601-ST1 ON SC-59 New 详细
DM74LS123N ON 16-PDIP New 详细
NCP45521IMNTWG-H ON 8-DFN (2x2) New 详细
NBSG86AMNG ON 16-QFN (3x3) New 详细
DF10S2 ON 4-SDIP New 详细
FDMS86152 ON Power56 New 详细
BCP56T1G ON SOT-223 New 详细
NCV4299D1R2 ON 8-SOIC New 详细
DB3 ON DO-35 New 详细
3EZ15D5G ON DO-41 New 详细