罗斌森
  • FES6G

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
FQD30N06TF_F080 ON D-Pak New 详细
CAT5112VI-10-T3 ON 8-SOIC New 详细
SZMM3Z3V0T1G ON SOD-323 New 详细
MOC3041FVM ON 6-SMD New 详细
FDG6332C-F085P ON SC-88/SC70-6/SOT-363 New 详细
2N4126TFR ON TO-92-3 New 详细
PN3645_D26Z ON TO-92-3 New 详细
1.5KE11A ON Axial New 详细
MC100LVEL12DTR2G ON 8-TSSOP New 详细
DSK10E ON New 详细
MM3Z3V3C ON SOD-323F New 详细
MC10E1652FNR2G ON 20-PLCC (9x9) New 详细
74ALVC162245TX ON 48-TSSOP New 详细
NCP4303BMNTWG ON 8-DFN (4x4) New 详细
CAT24C01WE-GT3 ON 8-SOIC New 详细
NLV14021BDR2 ON 16-SOIC New 详细
SZMMSZ4697T1G ON SOD-123 New 详细
FOD2712A ON 8-SOIC New 详细
MZP4735ARLG ON Axial New 详细
LV8417CS-TE-L-H ON 9-WLP (1.47x1.47) New 详细