罗斌森
  • FES6G

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
FDI8441 ON I2PAK (TO-262) New 详细
BC850BMTF ON SOT-23-3 New 详细
NCV8506D2T33 ON D2PAK-7 New 详细
FDN358P ON SuperSOT-3 New 详细
SZBZX84C2V7LT1G ON SOT-23-3 (TO-236) New 详细
MBR2030CTL ON TO-220AB New 详细
MV5B164 ON New 详细
MBRA120LT3 ON SMA New 详细
NCP161BFCS280T2G ON 4-WLCSP (0.64x0.64) New 详细
NCP1443T ON TO-220-7 New 详细
HUF75617D3S ON TO-252AA New 详细
FAN53555UC01X ON 20-WLCSP (1.96x1.56) New 详细
MC10EP29MNTXG ON New 详细
NCP3063BPG ON 8-PDIP New 详细
LM2574DW-ADJ ON 16-SOIC New 详细
1N968B_S00Z ON DO-35 New 详细
NC7WZ02L8X ON 8-MicroPak? New 详细
74AUP1G58FHX ON 6-MicroPak2? New 详细
LA4814JA-ZE ON 20-SSOP New 详细
MC10E452FNR2 ON New 详细