罗斌森
  • FES6D

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
GMA26881C ON New 详细
LC75897PWS-T-E ON 144-SQFP (20x20) New 详细
NM27C010T150 ON 32-TSOP New 详细
FQB12N50TM_AM002 ON D2PAK (TO-263AB) New 详细
FDB5800_F085 ON D2PAK New 详细
BD442 ON TO-225AA New 详细
MOC3032FR2M ON 6-SMD New 详细
2N4403TAR ON TO-92-3 New 详细
MC74LVX259MEL ON 16-SOEIAJ New 详细
NB6L611MNG ON 16-QFN (3x3) New 详细
1V5KE11A ON DO-201AE New 详细
LV8746VGEVB ON New 详细
FLZ3V0A ON SOD-80 New 详细
KAF-8300-CXB-CB-AA-OFFSET ON 32-CDIP New 详细
TCP-4118UB-DT ON 4-WLCSP (0.63x0.61) New 详细
MM74HC589SJ ON 16-SOP New 详细
FL7701MX ON 8-SOIC New 详细
LA4628-E ON 14-SIPHZ New 详细
TCP-4056UB-DT ON New 详细
NSB13211DW6T1G ON SC-88/SC70-6/SOT-363 New 详细