罗斌森
  • FES10J

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
MJD200T5G ON DPAK New 详细
7WBD3126BMX1TCG ON 8-ULLGA (1.6x1) New 详细
CAT5409YI50 ON New 详细
FDB86366-F085 ON D2PAK (TO-263AB) New 详细
NC7SZU04M5 ON SOT-23-5 New 详细
NBVSBA024LNHTAG ON 6-CLCC (7x5) New 详细
1N4446 ON DO-35 New 详细
ISL9R18120P2 ON TO-220AC New 详细
FQPF22P10 ON TO-220F New 详细
BC640TF ON TO-92-3 New 详细
74ALVC16245GX ON 54-FBGA (5.5x8) New 详细
FQPF9P25 ON TO-220F New 详细
1N758A_T50R ON DO-35 New 详细
MC74VHC1GT02DTT1 ON 5-TSOP New 详细
MC10E1652FNR2 ON 20-PLCC (9x9) New 详细
MMSZ5242ET1G ON SOD-123 New 详细
MMSZ4678T3G ON SOD-123 New 详细
LA5735MC-BH ON 8-SOIC New 详细
FQT5P10TF ON SOT-223-4 New 详细
MUN2212T1G ON SC-59 New 详细