罗斌森
  • FES10J

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
BZX79C5V6 ON DO-35 New 详细
LV52117QATXG ON 12-TDFN (3x3) New 详细
H11AG1SR2M ON 6-SMD New 详细
TIL117SR2M ON 6-SMD New 详细
MUN5330DW1T1G ON SC-88/SC70-6/SOT-363 New 详细
NCP1571DR2 ON 8-SOIC New 详细
NB3N62208MNG ON 20-QFN (4x4) New 详细
EFC4619R-A-TR ON EFCP1616-4CE-022 New 详细
MC12095MNR4G ON 8-DFN (2x2) New 详细
FAN5904BUC01X ON 16-WLCSP (1.71x1.71) New 详细
KSB1366GTU ON TO-220F New 详细
MPS6562_D26Z ON TO-92-3 New 详细
MC74HC245ADT ON 20-TSSOP New 详细
NSVBC857CWT1G ON SC-70-3 (SOT323) New 详细
FDMF6705V ON 40-PQFN (6x6) New 详细
MOC3081TVM ON 6-DIP New 详细
74AC273SJX ON New 详细
KA78RM33TSTU ON TO-220-3 New 详细
MC74LCX157DT ON 16-TSSOP New 详细
NTMFS4839NHT3G ON 5-DFN (5x6) (8-SOFL) New 详细