罗斌森
  • FES10G

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
SZMMSZ5232BT1G ON SOD-123 New 详细
MMSZ4699ET1 ON SOD-123 New 详细
MPSA75RLRP ON TO-92-3 New 详细
NCP4632BDT08T5G ON DPAK-5 (TO-252) New 详细
ADM1032AR-1REEL ON 8-SOIC New 详细
MM74HC125SJ ON 14-SOP New 详细
MPSA42RLRAG ON TO-92-3 New 详细
NCV4279A50D1G ON 8-SOIC New 详细
NRVUD620CTG-VF01 ON DPAK New 详细
M74VHC1GT86DTT1G ON 5-TSOP New 详细
74ACT151SCX ON 16-SOIC New 详细
1N5242B_T50A ON DO-35 New 详细
NCP571MN10TBG ON 6-DFN (2x2.2) New 详细
TN6715A ON TO-226-3 New 详细
MUR480EG ON Axial New 详细
NB2309AC1HDT ON 16-TSSOP New 详细
NCT475AFCT2G ON New 详细
BC548BBU ON TO-92-3 New 详细
QTLP912Y ON Subminiature T-3/4 New 详细
NCP692MNADJT2G ON 6-DFN (3x3) New 详细