罗斌森
罗斌森
  • FES10D

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
NCP302HSN30T1 ON 5-TSOP New 详细
MPSA92_D81Z ON TO-92-3 New 详细
MC100EPT24DTR2 ON 8-TSSOP New 详细
MOC3052VM ON 6-DIP New 详细
FQB5N40TM ON D2PAK (TO-263AB) New 详细
NTMFD4C88NT3G ON 8-DFN (5x6) New 详细
BD37725STU ON TO-126-3 New 详细
KSC2335Y ON TO-220-3 New 详细
NC7SZ384L6X ON 6-MicroPak New 详细
MC100H607FNR2G ON 28-PLCC (11.51x11.51) New 详细
MBR60H100CT ON TO-220AB New 详细
MM74HC00SJX ON 14-SOP New 详细
KSC2001YTA ON TO-92-3 New 详细
NTMFD4C88NT1G ON 8-DFN (5x6) New 详细
MC7905BD2TG ON D2PAK New 详细
74F191PC ON 16-PDIP New 详细
CAV25160VE-GT3 ON 8-SOIC New 详细
MC74AC04D ON 14-SOIC New 详细
NCP303LSN47T1 ON 5-TSOP New 详细
SS14FL ON SOD-123F New 详细
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