罗斌森
  • FES10D

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
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FNB51060T1 ON New 详细
2N4124TA ON TO-92-3 New 详细
FSL336LRN ON 7-DIP New 详细
MPSA28RLRPG ON TO-92-3 New 详细
NCP3418ADR2 ON 8-SOIC New 详细
H24B2 ON 4-DIP New 详细
FDS6911 ON 8-SOIC New 详细
74ACQ245SC ON 20-SOIC New 详细
MC100E143FN ON 28-PLCC (11.51x11.51) New 详细
NTGS3455T1 ON 6-TSOP New 详细
74F899QCX ON 28-PLCC (11.5x11.5) New 详细
MC1403BDR2G ON 8-SOIC New 详细
NTR3A052PZT1G ON SOT-23 (TO-236AB) New 详细
NSVBAS21SLT1G ON SOT-23-3 (TO-236) New 详细
FDMF5820TDC ON 31-PQFN (5x5) New 详细
NZF220TT1G ON New 详细
HLMP2450 ON New 详细