罗斌森
  • FES10D

  • Manufacturer : ON Semiconductor
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : *
    Part Status : Discontinued at Digi-Key
    Mounting Type : Surface Mount
    Package / Case : TO-277, 3-PowerDFN
    Supplier Device Package : TO-277-3

极速报价

型号
品牌 封装 批号 查看
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LC75897PWS-T-E ON 144-SQFP (20x20) New 详细
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1N4448TR ON DO-35 New 详细
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MC14025BDG ON 14-SOIC New 详细
NCP51510MNTAG ON 10-DFN (3x3) New 详细
NCP3337MN180R2G ON 10-DFN (3x3) New 详细
74AC245SCX ON 20-SOIC New 详细
TCA0372BDWR2 ON 16-SOIC New 详细
NCP502SQ28T1 ON SC-88A (SC-70-5/SOT-353) New 详细
MJF18004G ON TO-220FP New 详细
MMSZ4702 ON SOD-123 New 详细