罗斌森
  • WL1831MODGBMOCR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : WiLink?
    Part Status : Active
    RF Family/Standard : Bluetooth, WiFi
    Protocol : 802.11b/g/n, Bluetooth 4.2
    Modulation : CCK, DSSS, GFSK, OFDM
    Frequency : 2.4GHz
    Data Rate : 54Mbps
    Power - Output : 17.3dBm
    Sensitivity : -96.3dBm
    Serial Interfaces : SDIO, UART
    Voltage - Supply : 2.9V ~ 4.8V
    Current - Receiving : 49mA ~ 85mA
    Current - Transmitting : 238mA ~ 420mA
    Mounting Type : Surface Mount
    Operating Temperature : -20°C ~ 70°C
    Package / Case : 100-SMD Module

极速报价

型号
品牌 封装 批号 查看
ADC081C02XEB/NOPB TI New 详细
MSP430F5224IRGZR TI 48-VQFN (7x7) New 详细
TRS232IN TI 16-PDIP New 详细
LP3875ES-1.8 TI DDPAK/TO-263-5 New 详细
HDC1050DMBT TI 6-WSON (3x3) New 详细
DS16EV5110ASQE/NOPB TI 48-WQFN (7x7) New 详细
THS3062DGNRG4 TI 8-MSOP-PowerPad New 详细
TLC5620ID TI 14-SOIC New 详细
CSD13385F5 TI 3-PICOSTAR New 详细
74LVC1G132DBVTG4 TI SOT-23-5 New 详细
ADS7949SRTER TI 16-WQFN (3x3) New 详细
TPS53317EVM-750 TI New 详细
SN64BCT126ANG4 TI 14-PDIP New 详细
LM5041EVAL TI New 详细
SN75LBC172AN TI 16-PDIP New 详细
ISOW7821FDWER TI 16-SOIC New 详细
TPS78001DDCR TI SOT-23-5 New 详细
LP5912Q1.8DRVRQ1 TI 6-WSON (2x2) New 详细
LM15851NKET TI 68-VQFN (10x10) New 详细
ADS1253E TI 16-SSOP New 详细