罗斌森
  • WL1805MODGBMOCT

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : WiLink?
    Part Status : Active
    RF Family/Standard : Bluetooth, WiFi
    Protocol : 802.11b/g/n, Bluetooth 4.2
    Modulation : CCK, DSSS, GFSK, OFDM
    Frequency : 2.4GHz
    Data Rate : 54Mbps
    Power - Output : 17.3dBm
    Sensitivity : -96.3dBm
    Serial Interfaces : SDIO, UART
    Voltage - Supply : 2.9V ~ 4.8V
    Current - Receiving : 49mA ~ 85mA
    Current - Transmitting : 238mA ~ 420mA
    Mounting Type : Surface Mount
    Operating Temperature : -20°C ~ 70°C
    Package / Case : Module

极速报价

型号
品牌 封装 批号 查看
LM4050QAIM3-5.0/NOPB TI SOT-23-3 New 详细
TLV320AIC10CGQER TI 80-BGA MICROSTAR JUNIOR (5x5) New 详细
AM26LS31CD TI 16-SOIC New 详细
BQ27510DRZR-G2 TI 12-SON (2.5x4) New 详细
TPS61176RTER TI 16-WQFN (3x3) New 详细
SN74LVC1G123DCTT TI SM8 (SSOP) New 详细
TPA3251D2EVM TI New 详细
DS90CR285MTDX/NOPB TI 56-TSSOP New 详细
SN74LS156NSR TI 16-SO New 详细
THS4502IDGK TI 8-VSSOP New 详细
SN74LV273APWRG4 TI New 详细
TPS61059DRCRG4 TI 10-VSON (3x3) New 详细
CD4060BE TI 16-PDIP New 详细
LT1054IP TI 8-PDIP New 详细
DAC7611UB TI 8-SOIC New 详细
PCI1520ZHK TI 209-PBGA (16x16) New 详细
LP3990TLX-1.8/NOPB TI 4-DSBGA (1x1) New 详细
LM5113SDE/NOPB TI 10-WSON (4x4) New 详细
OPA361AQDCKRQ1 TI SC-70-6 New 详细
XIO2001ZGU TI 169-BGA MicroStar (12x12) New 详细