产品系列
产品系列
UCC3977PWG4
- Manufacturer : Texas Instruments
Packaging : Tube
Alternate Packaging
Part Status : Not For New Designs
Applications : Power Supplies
Current - Supply : 1mA
Voltage - Supply : 3V ~ 13.5V
Operating Temperature : 0°C ~ 70°C
Mounting Type : Surface Mount
Package / Case : 8-TSSOP (0.173", 4.40mm Width)
Supplier Device Package : 8-TSSOP
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| TSC2301IGQZR | TI | 120-BGA Microstar Junior (6x6) | New | 详细 | |
| LM3S1621-IBZ80-C5 | TI | 108-BGA (10x10) | New | 详细 | |
| TLV853MDBZR | TI | SOT-23-3 | New | 详细 | |
| TL032CP | TI | 8-PDIP | New | 详细 | |
| CSD87381P | TI | 5-PTAB (3x2.5) | New | 详细 | |
| LM2904PSR | TI | 8-SO | New | 详细 | |
| OPA2316SIDGSR | TI | 10-VSSOP | New | 详细 | |
| OPA128SM | TI | TO-99-8 | New | 详细 | |
| TPS65140RGER | TI | 24-VQFN (4x4) | New | 详细 | |
| BQ4010MA-85 | TI | 28-DIP Module (18.42x37.72) | New | 详细 | |
| SD307EVK/NOPB | TI | New | 详细 | ||
| LP3985ITLX-3.2/NOPB | TI | 5-DSBGA (1.41x1.08) | New | 详细 | |
| CD74HC221M96 | TI | 16-SOIC | New | 详细 | |
| LP38502TJ-ADJ/NOPB | TI | TO-263-5 Thin | New | 详细 | |
| DRV8846EVM | TI | New | 详细 | ||
| SN74LVC139ARGYR | TI | 16-VQFN (4x4) | New | 详细 | |
| 74ABTH16460DGGRE4 | TI | 56-TSSOP | New | 详细 | |
| LM340AS-5.0/NOPB | TI | DDPAK/TO-263-3 | New | 详细 | |
| SCAN921226HSMX/NOPB | TI | 49-BGA (7x7) | New | 详细 | |
| DS34LV86TM | TI | 16-SOIC | New | 详细 |
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