产品系列
产品系列
TWL6032A2B7YFFT
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Part Status : Active
Applications : Handheld/Mobile Devices, OMAP?
Current - Supply : 20μA
Voltage - Supply : 2.5V ~ 4.8V
Operating Temperature : -40°C ~ 85°C
Mounting Type : Surface Mount
Package / Case : 155-UFBGA, DSBGA
Supplier Device Package : 155-DSBGA (5.21x5.36)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| UC285TDKTTT-ADJ | TI | DDPAK/TO-263-5 | New | 详细 | |
| CD74AC139E | TI | 16-PDIP | New | 详细 | |
| TPS7A85EVM-754 | TI | New | 详细 | ||
| MSP430F235TPM | TI | 64-LQFP (10x10) | New | 详细 | |
| ADS8904BRGET | TI | 24-VQFN (4x4) | New | 详细 | |
| TRSF3223ECPW | TI | 20-TSSOP | New | 详细 | |
| LP55281RL/NOPB | TI | 36-DSBGA (3.5x3.24) | New | 详细 | |
| BQ29443DRBT | TI | 8-SON (3x3) | New | 详细 | |
| SN74F174AN | TI | New | 详细 | ||
| SN74LVC841APWT | TI | 24-TSSOP | New | 详细 | |
| LM4040D50QDBZR | TI | SOT-23-3 | New | 详细 | |
| LP3470M5-4.38/NOPB | TI | SOT-23-5 | New | 详细 | |
| CD4060BPWR | TI | 16-TSSOP | New | 详细 | |
| BQ3287EMT | TI | 24-DIP Module (18.42x18.72) | New | 详细 | |
| LP3875ESX-1.8 | TI | DDPAK/TO-263-5 | New | 详细 | |
| TMS320VC5409APGE16 | TI | 144-LQFP (20x20) | New | 详细 | |
| TLV5639CDWR | TI | 20-SOIC | New | 详细 | |
| BQ501210RGCR | TI | 64-VQFN (9x9) | New | 详细 | |
| UCC28730EVM-552 | TI | New | 详细 | ||
| LMH6645MF/NOPB | TI | SOT-23-5 | New | 详细 |
请把您的采购需求告诉我们！
Copyright © 2007-2021 All Rights Reserved. - 深圳市罗斌森电子科技有限公司
E-MAIL: 2500045293@QQ.COM
备案号粤ICP备2021120841号
E-MAIL: 2500045293@QQ.COM
备案号粤ICP备2021120841号
网站设计webdesign www.wzdzkf.com