产品系列
产品系列
TWL6030B1A4CMR
- Manufacturer : Texas Instruments
Packaging : Bulk
Alternate Packaging
Part Status : Active
Applications : Handheld/Mobile Devices, OMAP?
Current - Supply : 20μA
Voltage - Supply : 2.5V ~ 4.8V
Operating Temperature : -40°C ~ 85°C
Mounting Type : Surface Mount
Package / Case : 187-VFBGA, FCBGA
Supplier Device Package : 187-FCBGA (7x7)
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| TPS78633KTTR | TI | DDPAK/TO-263-5 | New | 详细 | |
| LM3S101-IGZ20-C2 | TI | 48-VQFN (7x7) | New | 详细 | |
| ADS809Y/250 | TI | 48-HTQFP (7x7) | New | 详细 | |
| TPS74601PBDRVT | TI | New | 详细 | ||
| ADC081S051CIMF/NOPB | TI | SOT-23-6 | New | 详细 | |
| BQ24725RGRT | TI | 20-VQFN (3.5x3.5) | New | 详细 | |
| TPS7A7300EVM-718 | TI | New | 详细 | ||
| BQ2057WTS | TI | 8-TSSOP | New | 详细 | |
| TLE2021AIP | TI | 8-PDIP | New | 详细 | |
| ADS7851IRTER | TI | 16-WQFN (3x3) | New | 详细 | |
| LM70CILD-5/NOPB | TI | 8-WSON (3x3) | New | 详细 | |
| TLE2426CLPR | TI | TO-92-3 | New | 详细 | |
| ADC0803LCN/NOPB | TI | 20-DIP | New | 详细 | |
| MAX3243ECDBR | TI | 28-SSOP | New | 详细 | |
| TCA6416RTWT | TI | 24-WQFN (4x4) | New | 详细 | |
| LMZ23603EVAL/NOPB | TI | New | 详细 | ||
| SN65HVD37DR | TI | 14-SOIC | New | 详细 | |
| SN74LVC2G04YZPR | TI | 6-DSBGA, 6-WCSP (1.4x0.9) | New | 详细 | |
| DRV3204QPHPQ1 | TI | 48-HTQFP (7x7) | New | 详细 | |
| UC385TDKTTT-ADJ | TI | DDPAK/TO-263-5 | New | 详细 |
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