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TPS826951SIPR
- Manufacturer : Texas Instruments
Packaging : Cut Tape (CT)
Alternate Packaging
Series : MicroSip?
Part Status : Active
Type : Non-Isolated PoL Module
Number of Outputs : 1
Voltage - Input (Min) : 2.3V
Voltage - Input (Max) : 4.8V
Voltage - Output 1 : 2.5V
Current - Output (Max) : 800mA
Applications : ITE (Commercial)
Features : OCP, OTP, SCP, UVLO
Operating Temperature : -40°C ~ 85°C
Efficiency : 95%
Mounting Type : Surface Mount
Package / Case : 8-BGA Module
Size / Dimension : 0.12" L x 0.09" W x 0.04" H (3.0mm x 2.4mm x 1.0mm)
Supplier Device Package : 8-uSIP
型号 |
品牌 | 封装 | 批号 | 查看 | |
|---|---|---|---|---|---|
| LM2736XMK | TI | TSOT-23-6 | New | 详细 | |
| SN74LVC162244AGQLR | TI | 56-BGA MICROSTAR JUNIOR (7.0x4.5) | New | 详细 | |
| SN74ALS623AN | TI | 20-PDIP | New | 详细 | |
| DS14C535MSAX/NOPB | TI | 28-SSOP | New | 详细 | |
| LP3962ESX-2.5/NOPB | TI | DDPAK/TO-263-5 | New | 详细 | |
| ADS574JEG4 | TI | 28-PDIP | New | 详细 | |
| DP83867CRRGZT | TI | 48-VQFN (7x7) | New | 详细 | |
| OPA2357AIDGSR | TI | 10-VSSOP | New | 详细 | |
| REG103FA-5KTTT | TI | DDPAK/TO-263-5 | New | 详细 | |
| SN74ALS165DR | TI | 16-SOIC | New | 详细 | |
| TP3070V-XG | TI | 28-PLCC (11.51x11.51) | New | 详细 | |
| SN74AUP1G07YFPR | TI | 4-DSBGA (0.8x0.8) | New | 详细 | |
| CDC391D | TI | 16-SOIC | New | 详细 | |
| LMR10530YSDEVM/NOPB | TI | New | 详细 | ||
| LM2941LDX/NOPB | TI | 8-WSON (4x4) | New | 详细 | |
| TMS320C6416TBZLZD1 | TI | 532-FCBGA (23x23) | New | 详细 | |
| TIBPAL16R6-5CFN | TI | 20-PLCC (9x9) | New | 详细 | |
| SN74ALS651ADWR | TI | 24-SOIC | New | 详细 | |
| AM3352BZCZD60 | TI | 324-NFBGA(15x15) | New | 详细 | |
| DS14C335MSAX | TI | 28-SSOP | New | 详细 |
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