罗斌森
  • TPS826721SIPR

  • Manufacturer : Texas Instruments
    Packaging : Cut Tape (CT)
    Alternate Packaging
    Series : MicroSip?
    Part Status : Active
    Type : Non-Isolated PoL Module
    Number of Outputs : 1
    Voltage - Input (Min) : 2.3V
    Voltage - Input (Max) : 4.8V
    Voltage - Output 1 : 2.1V
    Current - Output (Max) : 600mA
    Applications : ITE (Commercial)
    Features : Remote On/Off, OCP, OTP, UVLO
    Operating Temperature : -40°C ~ 85°C
    Efficiency : 90%
    Mounting Type : Surface Mount
    Package / Case : 8-BGA Module
    Size / Dimension : 0.12" L x 0.09" W x 0.04" H (3.0mm x 2.4mm x 1.0mm)
    Supplier Device Package : 8-uSIP
    Control Features : Enable, Active High

极速报价

型号
品牌 封装 批号 查看
SN65LVPE502ARLLR TI 24-VQFN (3x3) New 详细
ADS5433IPJYR TI 52-QFP (10x10) New 详细
TSB43AA82PGE TI 144-LQFP (20x20) New 详细
PCI7410GHK TI 209-PBGA (16x16) New 详细
CC2420RTC TI 48-VQFN (7x7) New 详细
SN74ALVCH16501KR TI 56-BGA MICROSTAR JUNIOR (7.0x4.5) New 详细
PGA2500IDBR TI 28-SSOP New 详细
LM4128BMFX-3.3 TI SOT-23-5 New 详细
LMH6503MAX TI 14-SOIC New 详细
TLVH431BCPK TI SOT-89-3 New 详细
TPS72718YFFT TI 4-DSBGA (1x1) New 详细
UA7815CKCT TI TO-220-3 New 详细
ADS1286UA TI 8-SOIC New 详细
LP5907QMFX-1.8Q1 TI SOT-23-5 New 详细
SN75DP128RTQR TI 56-QFN (8x8) New 详细
74GTLPH16912VRE4 TI 56-TVSOP New 详细
ADS1282EVM-PDK TI New 详细
TPA0253EVM TI New 详细
TPA3001D1PWP TI 24-HTSSOP New 详细
TPS61310EVM-638 TI New 详细